International Conference on Mechatronics, Electronic, Industrial and Control Engineering (MEIC), Apr 2015, Shenyang, PEOPLES R, China. pp.539-542. ⟨hal-03224668⟩

Article dans une revue

Introduction to Advances in Historical Studies Special Issue: Exploring Changes in How the Histories of the Exact Sciences Have Been Written: Interpreting the Dynamics of Change in These Sciences and Interrelations amongst Them—Past Problems, Future Cures?

Raffaele Pisano, Paolo Bussotti

Advances in Historical Studies, 2015, 04 (02), pp.65-67. ⟨10.4236/ahs.2015.42007⟩. ⟨hal-04507575⟩

Article dans une revue

Compact Modeling of Single Electron Memory Based on Perceptron Designs

Aïmen Boubaker, Abdelghaffar Nasri, Adel Kalboussi, B. Hafsi

Journal of Materials Science and Engineering, 2015, 04 (05), ⟨10.4172/2169-0022.1000187⟩. ⟨hal-04422399⟩

Article dans une revue

V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology

A. Chahadih, Pierre-Yves Cresson, C. Mismer, T. Lasri

In this letter, a grounded coplanar waveguide-to-microstrip (GCPW-to-MS) transition without via holes is presented. The transition is designed on a PET® substrate and fabricated using inkjet printing technology. To our knowledge, fabrication of transitions using inkjet printing technology has not...

IEEE Microwave and Wireless Components Letters, 2015, 25 (7), pp.436-438. ⟨10.1109/LMWC.2015.2427576⟩. ⟨hal-03538488⟩

Article dans une revue

Ultrasonic reflectometry in air: errors of sample positioning

Mariusz Kaczmarek, Bogdan Piwakowski, Radoslaw Drelich

The reflection coefficient of ultrasonic waves propagating in air and interacting with a plane surface of a solid is considered. The simulation of dependence of the reflection coefficient on errors of sample positioning is performed using a finite beam model along with an angular spectrum method,...

Journal of the Acoustical Society of America, 2015, 137 (1), pp.261-272. ⟨10.1121/1.4904533⟩. ⟨hal-03639070⟩

Communication dans un congrès

De-embedding differential noise figure using the correlation of output noise waves

Francois Graux, Francois Danneville, Yogadissen Andee, Caroline Arnaud

This paper presents a measurement technique for de-embedding the noise figure of all sorts of differential amplifiers having arbitrary common-mode rejection. It is based on the measurement of the correlation of the noise waves at the output ports of the differential amplifier. It makes use of a...

85th ARFTG Microwave Measurement Conference, May 2015, Phoenix, United States. ⟨10.1109/ARFTG.2015.7162917⟩. ⟨hal-03272694⟩

Communication dans un congrès

Room-Temperature, Zero-Bias Plasmonic THz Detection by Asymmetric Dual-Grating-Gate HEMT

Takayuki Watanabe, Tetsuya Kawasaki, Akira Satou, Stéphane Boubanga-Tombet, Tetsuya Suemitsu, Guillaume Ducournau, Dominique Coquillat, Wojciech Knap, Hiroaki Minamide, Hiromasa Ito, Viacheslav Popov, Yahya Moubarak Meziani, Taiichi Otsuji

We study theoretically and experimentally the plasmonic THz detection by the asymmetric dual-grating-gate HEMT at room temperature without source-to-drain bias. We derive the analytical expressions of photocurrents due to the plasmonic drag and ratchet effects, and we discuss about their frequency...

Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications VIII, Feb 2015, San Francisco, United States. pp.93620F, ⟨10.1117/12.2079184⟩. ⟨hal-01163013⟩

Communication dans un congrès

Characterization of flexible CMOS technology tranferred onto a metallic foil

Justine Philippe, Aurelien Lecavelier Des Etangs-Levallois, Philip Latzel, Francois Danneville, J.F. Robillard, Daniel Gloria, Emmanuel Dubois

In this work we demonstrate a method to transfer high-performance industrial CMOS circuits thinned down to 5.7 mu m and bond onto a 25-mu m-thick stainless steel foil with a 800-nm-thick indium layer. The bonding is performed at the temperature of 100 degrees C with an applied pressure of 1.2 bar....

2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, Jan 2015, Bologna, Italy. ⟨10.1109/ULIS.2015.7063747⟩. ⟨hal-03272691⟩