Publicaciones

• Article dans une revue

TEM characterisation of the erbium silicide formation process using a Pt/Er stack on the silicon-on-insulator substrate

A. Łaszcz, J. Katcki, J. Ratajczak, Xing Tang, Emmanuel Dubois

Very thin erbium silicide layers have been used as source and drain contacts to n-type Si in low Schottky barrier MOSFETs on silicon-on-insulator substrates. Erbium silicide is formed by a solid-state reaction between the metal and silicon during annealing. The influence of annealing temperature (...

Journal of Microscopy, 2006, 224 (1), pp.38-41. ⟨10.1111/j.1365-2818.2006.01653.x⟩. ⟨hal-00138660⟩

• Autre publication scientifique

Modélisation de l'interaction entre une onde de Lamb et une interface rugueuse.

Catherine Potel, Michel Bruneau, Claude L. Depollier, Damien Leduc, Bruno Morvan, Philippe Pareige, Jean-Louis Izbicki, Anne-Christine Hladky

2006. ⟨hal-00135218⟩

• Communication dans un congrès

Modal couplings in a rough fluid plate.

Catherine Potel, Michel Bruneau, Anne-Christine Hladky, Bruno Morvan, Jean-Louis Izbicki, Claude L. Depollier

4èmes journées du GDR "Modal couplings in a rough fluid plate", May 2006, Gien, France. ⟨hal-00135409⟩

• Article dans une revue

Correlation between porosity, permeability and ultrasonic parameters of mortar with variable water / cement ratio and water content

Zoubeir Lafhaj, Marc Goueygou, Assia Djerbi, Mariusz Kaczmarek

This paper presents results of studies of ultrasonic and structural parameters of mortar. The objective of the study is to determine correlations between ultrasonic pulse velocity (UPV), porosity and permeability. The material investigated consists in seven mortar mixtures with water / cement ratio...

Cement and Concrete Research, 2006, 36, pp.625-633. ⟨10.1016/j.cemconres.2005.11.009⟩. ⟨hal-00069698⟩

• Communication dans un congrès

Ultrasonics assessment of draining kinetic and adhesion phenomenon during cheese manufacture

Georges Nassar, M.N. Sabra, Fabrice Lefebvre, Malika Toubal, Bertrand Nongaillard, Y. Noel

2006, pp.327-328. ⟨hal-00138736⟩

• Communication dans un congrès

Boron migration length in silicon : molecular dynamics versus experiments

V. Cuny, E. Lampin, Christophe Krzeminski, F. Cleri

Materials Research Society Spring Meeting, MRS Spring 2006, Sub-Second Rapid Thermal Processing for Device Fabrication, 2006, Moscone West, San-Franscico, CA, United States. ⟨hal-00138696⟩

• Communication dans un congrès

Pseudospectral simulations of elastic waves propagation in heterogeneous nonlinear hysteretic medium

Olivier Bou Matar, S. dos Santos, J. Fortineau, T. Goursolle, L. Haumesser, F. van Der Meulen

2006, pp.95-98. ⟨hal-00138608⟩

• Article dans une revue

Optimisation of HSQ e-beam lithography for the patterning of FinFET transistors

F. Fruleux, J. Penaud, Emmanuel Dubois, M. Francois, M. Muller

FinFET transistors are presented as promising candidates to extend CMOS lifetime. One major challenging technological step in the process fabrication of such devices is the patterning of narrow, sharp, densely packed silicon fins. As an attempt to face this challenge, hydrogen silsesquioxane (HSQ)...

Microelectronic Engineering, 2006, 83, pp.776-779. ⟨10.1016/j.mee.2006.01.159⟩. ⟨hal-00138652⟩

• Communication dans un congrès

Impact of phase and timing jitter on IFDMA systems

E. Simon, R. Legouable, M. Helard, M. Lienard

2006, 5 pp. ⟨hal-00142612⟩

• Communication dans un congrès

Méthode pour l'évaluation du couplage EM exercé par un connecteur blindé installé sur circuit imprimé

Y. Bouri, L. Kone, S. Barlerin, S. Baranowski, B. Demoulin

2006, pp.224-226. ⟨hal-00142611⟩