Publicaciones

• Article dans une revue

Controllable skyrmion chirality in ferroelectrics

Yu Tikhonov, S. Kondovych, J. Mangeri, M. Pavlenko, L. Baudry, A. Sene, A. Galda, S. Nakhmanson, O. Heinonen, A. Razumnaya, I Luk'Yanchuk, V. M. Vinokur

Chirality, an intrinsic handedness, is one of the most intriguing fundamental phenomena in nature. Materials composed of chiral molecules find broad applications in areas ranging from nonlinear optics and spintronics to biology and pharmaceuticals. However, chirality is usually an invariable...

Scientific Reports, 2020, 10 (1), pp.8657. ⟨10.1038/s41598-020-65291-8⟩. ⟨hal-03321562⟩

• Communication dans un congrès

Characterization of Kapton, FeBO3 and Sapphire in the THz Region

E. Kueny, M. Lavancier, Romain Peretti, R. Rohlsberger, F. X. Kartner, A.-L. Calendron

2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Nov 2020, Buffalo, NY, USA, United States. pp.1-2, ⟨10.1109/IRMMW-THz46771.2020.9371004⟩. ⟨hal-03191458⟩

• Communication dans un congrès

Near-field measurement and far-field characterization of a J-band antenna based on an electro-optic sensing

Shintaro Hisatake, Yusuke Tanaka, Cybelle Belem-Gonçalves, Cyril Luxey, Frédéric Gianesello, Guillaume Ducournau, Akihiko Hirata

In this paper, we present a near-field pattern measurement based on an electro-optic sensing at 300 GHz band. The measurement system is based on a self-heterodyne technique and non-polarimetric frequency down-conversion technique. The far-field radiation pattern of a horn antenna calculated from...

14th European Conference on Antennas and Propagation (EuCAP), Mar 2020, Copenhagen, Denmark. paper 9135318, 4 p., ⟨10.23919/EuCAP48036.2020.9135318⟩. ⟨hal-03322801⟩

• Communication dans un congrès

On the teaching mode in online course of MEMS fundamental theory

Jinying Zhang, Wei-Jiang Xu, Xianmei Wu, Zhuo Li, Xin Wang, Suhui Yang

Massive offline courses have been transferred to online in higher education reform all over the world. This paper presents a teaching mode integrated with finite element numerical simulation in the fundamental theory study in MEMS (Micro-Electro-Mechanical Systems) online course for the graduate...

International Conference on Teaching, Assessment, and Learning for Engineering (IEEE TALE 2020), Dec 2020, Takamatsu, Japan. ⟨10.1109/TALE48869.2020.9368413⟩. ⟨hal-03322815⟩

• Article dans une revue

Mechanisms of a rectifying TiN gate contact for AlGaN/GaN HEMTs on silicon substrate

Hassane Ouazzani Chahdi, Brahim Benbakhti, Maghnia Mattalah, Jean Claude Gerbedoen, Abdelatif Jaouad, Nour Eddine Bourzgui, Ali Soltani

Rectifying Titanium Nitride (TiN) gate contact technology is developed for AlGaN/GaN based micro and nanometer HEMTs. A high compressive strain occurring in thinner TiN films (ranging from 5 nm to 60 nm), deposited by sputtering, leads to a reduction in tensile strain at the surface of AlGaN...

IEEE Transactions on Nanotechnology, 2020, 19, pp.682-688. ⟨10.1109/TNANO.2020.3019916⟩. ⟨hal-03322826⟩

• Communication dans un congrès

Application of the GPR and ERT methods for non-invasive examination of a flood dike

Tomislaw Golebiowski, Bogdan Piwakowski, Michal Cwiklik

As part of the NAWA-EMMAT project, geophysical surveys were carried out on selected sites in Poland, i.e. on the flood dike and in the surrounding of the concrete water dam. The goal of the surveys was the non-invasive detection of loose zones in the flood dike and fractured zones located in the...

9th Scientific-Technical Conference on E-mobility, Sustainable Materials and Technologies (MATBUD), Oct 2020, Cracow, Poland. pp.01010, ⟨10.1051/matecconf/202032201010⟩. ⟨hal-03322808⟩

• Article dans une revue

Utilisation du silicium nanostructuré dans un générateur thermoélectrique pour la réduction des pertes thermiques

Katir Ziouche, Ibrahim Bel-Hadj, Zahia Bougrioua

Dans cet article, nous présentons des microgénérateurs thermoélectriques (μTEG) planaires réalisés en technologie Silicium compatible CMOS, et destinés à la récupération de toute forme d’énergie thermique. Ceux-ci utilisent des matériaux faible coût, abondants et respectueux de l’environnement. La..., In this paper, we present a planar thermoelectric microgenerator (μTEG) based on CMOS-compatible silicon technology to harvest all forms of thermal energy. These have made by using low cost, abundant and eco-friendly materials. The heat harvesting has performed with a silicon concentrator. The...

Entropie : thermodynamique – énergie – environnement – économie, 2020, 1 (1), 10 p. ⟨10.21494/ISTE.OP.2020.0493⟩. ⟨hal-02906722⟩

• Communication dans un congrès

Effects of the electrical limit conditions on the electromechanical behavior of piezoelectric transducer arrays

Abdelmajid Bybi, Adil Ammar, Mohammed Garoum, Sébastien Grondel, Ahmed Mzerd, Anne-Christine Hladky

Crosstalk is an undesirable phenomenon having a negative impact on the electroacoustic performance of ultrasonic transducer arrays, utilized in medical imaging and NDT applications. Indeed, when one element of a transducer array is excited, it generates parasitic voltages and/or displacement fields...

4th International Conference on Electrical and Information Technologies, ICEIT 2020, Mar 2020, Rabat, Morocco. pp.1-6, ⟨10.1109/ICEIT48248.2020.9113231⟩. ⟨hal-03209107⟩

• Communication dans un congrès

[Invited] Texturation of lead-free BaTiO₃ based piezoelectric ceramics

Pascal Marchet, Angel Prato, Franck Levassort, Claire Bantignies, Ana Borta-Boyon, Anne-Christine Hladky

Piezoelectric ceramics have been integrated for a long time in a widerange of devices, particularly in ultrasonic applications (sonar systems,medical imaging...) and most of them use Pb(Zr,Ti)O₃ (PZT) materials.However, due to health care and environmental problems, lead...

• Communication dans un congrès

Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding

Solene Bossut, Arnaud Devos, S Lhostis, E Deloffre, C Euvrard, F Dettoni, C Chaton

Nowadays, microelectronics is making progress in miniaturization and diversification of chips by 3D integration: dies are stacked together to gain space and performances. The stacking used here is called hybrid bonding [1], as stacked surfaces are heterogeneous: part Cu and part oxide. After the...

Forum Acusticum, Dec 2020, Lyon, France. pp.2553-2554, ⟨10.48465/fa.2020.0878⟩. ⟨hal-03240341⟩