Publicaciones

Affichage de 5751 à 5760 sur 16279


  • Brevet

Substrat microstructuré

Christophe Lethien, Pascal Tilmant, Etienne Eustache, Nathalie Rolland, Thierry Brousse

Japon, N° de brevet: JP2017500211 (A) 2017-01-05. 2017, N° de priorité : FR20130059717 20131007 - N° de demande : JP20160520666 20141002. ⟨hal-05661705⟩

  • Article dans une revue

Theoretical and experimental study of a thermal damper based on a CNT/PCM composite structure for transient electronic cooling

Christophe Kinkelin, Stéphane Lips, Ulrich Soupremanien, Vincent Remondière, Jean Dijon, Hélène Le Poche, Emmanuel Ollier, Malek Zegaoui, Nathalie Rolland, Paul-Alain Rolland, Sandrine Lhostis, Brigitte Descouts, Yann Kaplan, Frédéric Lefèvre

The present study focuses on a thermal damper that aims at smoothing the temperature peaks experienced by electronic components during transient solicitations. It consists of a silicon casing containing a densified or undensified carbon nanotube (CNT) array - linking directly both sides of the...

Energy Conversion and Management, 2017, 142, pp.257-271. ⟨10.1016/j.enconman.2017.03.034⟩. ⟨hal-01494833⟩

  • Article dans une revue

International Summer School, Lille Report

Raffaele Pisano

Viewpoint, 2017, 110 (6), pp.13-14. ⟨hal-04509329⟩

  • Autre publication scientifique

Advances in Historical Studies [Editor in Chief 6/4]

Raffaele Pisano

2017. ⟨hal-04511010⟩

  • Article dans une revue

3D patterning of silicon by contact etching with anodically biased nanoporous gold electrodes

Encarnación Torralba, Mathieu Halbwax, Taha El Assimi, Marin Fouchier, Vincent Magnin, Joseph Harari, Jean-Pierre Vilcot, Sylvain Le Gall, Raphaël Lachaume, Christine Cachet-Vivier, Stéphane Bastide

A novel strategy to achieve 3D pattern transfer into silicon in a single step without using lithography is presented. Etching is performed electrochemically in HF media by contacting silicon with a positively biased, patterned, metal electrode. Dissolution is localized at the Si/metal contacts and...

Electrochemistry Communications, 2017, 76, pp.79-82. ⟨10.1016/j.elecom.2017.01.014⟩. ⟨hal-01480682⟩