Publicaciones
Affichage de 13461 à 13470 sur 16558
A Closed-Form Formulation for the Total Power Radiated by a Single-Wire Overhead Line
Andrea Cozza, Flavio G. Canavero, Bernard Démoulin
16th International Symposium on Electromagnetic Compatibility, EMC Zurich, Feb 2005, Switzerland. pp.529-534. ⟨hal-00518347⟩
11% efficiency 100 GHz InP-based heterostructure barrier varactor quintupler
T. Bryllert, A. Olsen, J. Vukusic, T.A. Emadi, M. Ingvarson, J. Stake, D. Lippens
Electronics Letters, 2005, 41 (3), pp.131-132. ⟨10.1049/el:20057633⟩. ⟨hal-00154899⟩
Nanoélectronique : un passeport pour le nanomonde
O. Vanbesien
Techniques de l'Ingénieur, TI Sciences et Techniques, Paris, France, pp.RE-32, 2005. ⟨hal-00132086⟩
Strained heteroepitaxy on nanomesas: a way toward perfect lateral organization of quantum dots
Maxime Bavencoffe, Eglantine Houdart, Catherine Priester
Journal of Crystal Growth, 2005, 275 (1-2), pp.305-316. ⟨10.1016/j.jcrysgro.2004.10.145⟩. ⟨hal-02112564⟩
Close infrared thermography using an intensified CCD camera : application in nondestructive high resolution evaluation of electrothermally actuated MEMS
B. Serio, J.J. Hunsinger, F. Conseil, P. Derderian, D. Collard, L. Buchaillot, M.F. Ravat
2005, pp.819-829. ⟨hal-00147502⟩
Terahertz radiation from heavy-ion-irradiated In0.53Ga0.47As photoconductive antenna excited at 1.55 µm
N. Chimot, J. Mangeney, L. Joulaud, P. Crozat, H. Bernas, K. Blary, Jean-Francois Lampin
Applied Physics Letters, 2005, 87, pp.193510-1-3. ⟨hal-00162806⟩
Optimisation de la correction de biais dans le récepteur PIC multi-étages pour le système CDMA
M. Moussaoui
2005. ⟨hal-00162808⟩
Terahertz emission from nanometric HEMTs analyzed by noise spectra
J.F. Millithaler, L. Varani, C. Palermo, J. Mateos, T. Gonzalez, S. Perez, D. Pardo, W. Knap, J. Lusakowski, N. Dyakonova, S. Bollaert, A. Cappy
Terahertz emission from nanometric HEMTs analyzed by noise spectra, 2005, Salamanca, Spain. pp.335-338, ⟨10.1063/1.2036763⟩. ⟨hal-00154896⟩
High performances of InP channel power HEMT at 94 GHz
F Medjdoub, M. Zaknoune, X. Wallart, Christophe Gaquière, D. Theron
Electronics Letters, 2005, 41, pp.1406-1408. ⟨hal-00154912⟩
Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices
G. Ulliac, S. Garidel, Jean-Pierre Vilcot, P. Tilmant
Microelectronic Engineering, 2005, 81, pp.53-58. ⟨hal-00125664⟩