Publicaciones
Affichage de 13991 à 14000 sur 16104
Caractérisation expérimentale de charges appliquées à la modélisation CEM d'équipements électroniques automobiles
S. Egot, M. Klinger, L. Kone, S. Baranowski, B. Demoulin
Actes du 12ème Colloque International et Exposition sur la Compatibilité Electromagnétique, CEM'04, 2004, Toulouse, France. ⟨hal-00142319⟩
Polymer-based monolithic columns prepared in microchannels for proteomics applications
S. Le Gac, S. Arscott, C. Cren, C. Rolando
17th International Symposium on Microscale Separations and Capillary Electrophoresis, 2004, Salzburg, Austria. ⟨hal-00141033⟩
TP de nanotechnologie : réalisation et observation de nanofils de silicium à l'aide de l'AFM
Bernard Legrand, H. Happy
8èmes Journées Pédagogiques du CNFM, 2004, Saint Malo, France. ⟨hal-00133919⟩
Strong oscillations detected by picosecond ultrasonics in silicon : evidence for an electronic structure effect
Arnaud Devos, R. Cote
Physical Review B: Condensed Matter and Materials Physics (1998-2015), 2004, 70, pp.125208-1-6. ⟨hal-00133851⟩
Materials for high performance cymbal transducer
A. Dogan, E. Uzgur, R.J. Meyer, Anne-Christine Hladky, R.E. Newnham
Journal of Electroceramics, 2004, 13, pp.403-408. ⟨hal-00133852⟩
PZT vector sensor
R. Newnham, D. Markley, R. Meyer, Anne-Christine Hladky, J. Cochran
2004 US Navy Workshop on Acoustic Transduction Materials and Devices, 2004, State College, PA, United States. ⟨hal-00133869⟩
Sign reversal and tunable rectification in a ballistic nanojunction
B. Hackens, L. Gence, C. Gustin, X. Wallart, S. Bollaert, A. Cappy, V. Bayot
Applied Physics Letters, 2004, 85, pp.4508-4510. ⟨hal-00133885⟩
Pulse Compression with Superluminal Group Velocity in 1-D Photonic Bandgap Coplanar Waveguide
Marc Le Roy, Eric Lheurette, André Pérennec
34th European Microwave Conference, Oct 2005, Amsterdam, France. pp.463-466, ⟨10.1109/EUMC.2004.1610077⟩. ⟨hal-00809272⟩
Dispositif automatique pour le contrôle non destructif du béton par ondes de surface
Bogdan Piwakowski
Diagnobéton 2004, 2004, Montreal, Canada. ⟨hal-00248104⟩
Versatile bondpad report process for non-planar compound semiconductor devices
S. Garidel, Jean-Pierre Vilcot, M. Zaknoune, P. Tilmant
Microelectronic Engineering, 2004, 71, pp.358-362. ⟨hal-00162776⟩