Publicaciones

Affichage de 15661 à 15670 sur 16261


  • Communication dans un congrès

Numerical modeling of magnetostrictive materials using the finite element code ATILA

J. Coutte, E. Lenglet, Bertrand Dubus

US Navy Workshop on Acoustic Transduction Materials and Devices, 2000, State College, United States. ⟨hal-00157834⟩

  • Communication dans un congrès

Underwater characteristics of cymbal transducers and arrays

J. Zhang, J. Hughes, Anne-Christine Hladky, R.E. Newnham

ONR Workshop on Acoustic Transduction Materials and Devices, 2000, University Park, United States. ⟨hal-00157837⟩

  • Communication dans un congrès

STM studies of organic molecules on Si(100) : what can we learn ?

D. Stievenard

Research Conference on Manipulation of Individual Atoms and Molecules, 2000, Les Houches, France. ⟨hal-00158964⟩

  • Article dans une revue

Simultaneous generation of longitudinal and shear bulk ultrasonic waves in solids

Jean-Michel Rouvaen, Atika Rivenq, P. Logette, Philippe Goutin, F. Haine

Journal of Physics D: Applied Physics, 2000, 33, pp.1287-1297. ⟨hal-00159053⟩

  • Article dans une revue

Study in a UHF electromagnetic resonant cavity of a bubble field induced by ultrasonic cavitation

S. Labouret, J. Frohly

European Physical Journal: Applied Physics, 2000, 10, pp.231-237. ⟨hal-00159067⟩

  • Communication dans un congrès

On 2D/3D numerical oxidation modeling : calibration and investigation of silicon crystal orientation effect on stresses in shallow trench isolations

T. Hoffmann, K.F. Dombrowski, V. Senez

2000, pp.59-62. ⟨hal-00158513⟩

  • Communication dans un congrès

Microsysteme : un état des lieux, enjeux et perspectives

D. Collard, L. Buchaillot, Bernard Legrand

48èmes Journées Nationales de l'Union des Physiciens, 2000, Lille, France. ⟨hal-00158538⟩

  • Communication dans un congrès

Microsystème : enjeux et perspectives

D. Collard, L. Buchaillot, Bernard Legrand

Journée IMAPS : International Microelectronics and Packaging Society, 2000, Lille, France. ⟨hal-00158539⟩

  • Communication dans un congrès

Low cost PIC transceiver TO can modules fulfilling FSAN specifications

F. Mallecot, A. Leroy, F. Doukhan, Y. Arnaudin, Joseph Harari, Didier Decoster, F. Laune

2000, pp.aer 86. ⟨hal-00158606⟩