Publicaciones

• Article dans une revue

Wafer level packaging compatible with millimeter-wave antenna

Etienne Herth, Seonho Seok, Nathalie Rolland, T. Lasri

his paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This...

Sensors and Actuators A: Physical , 2012, 173, pp.238-243. ⟨10.1016/j.sna.2011.09.040⟩. ⟨hal-00788267⟩

• Communication dans un congrès

Negative refraction of waves using a phononic crystal made of metal-based microstructure

Anne-Christine Hladky, S. Degraeve, Charles Croënne, Jerome O. Vasseur, G. Haw, Bertrand Dubus, L. Haumesser, A. Norris

IEEE International Ultrasonics Symposium, IUS 2012, 2012, Dresden, Germany. ⟨hal-00797229⟩

• Communication dans un congrès

Negative refraction of waves in a metal based microstructure phononic crystal

Anne-Christine Hladky, Charles Croënne, Jerome O. Vasseur, G. Haw, Bertrand Dubus, A. Norris

7èmes Journées du GdR 2501, ''Wave Propagation in Complex Media for Quantitative and Non Destructive Evaluation'', 2012, Oléron, France. ⟨hal-00797227⟩

• Article dans une revue

Bias dependence of gallium nitride micro-electro-mechanical systems actuation using a two-dimensional electron gas

A. Ben Amar, M. Faucher, B. Grimbert, Y. Cordier, M. François, P. Tilmant, M. Werquin, V. Zhang, D. Ducatteau, Christophe Gaquière, L. Buchaillot, D. Theron

Japanese Journal of Applied Physics, part 2 : Letters, 2012, 5, pp.067201-1-3. ⟨10.1143/APEX.5.067201⟩. ⟨hal-00787414⟩

• Article dans une revue

A 1 k-pixel video camera for 0.7-1.1 terahertz imaging applications in 65-nm CMOS

R. Al Hadi, H. Sherry, J. Grzyb, Y. Zhao, W. Forster, H.M. Keller, A. Cathelin, A. Kaiser, U.R. Pfeiffer

IEEE Journal of Solid-State Circuits, 2012, 47, pp.2999-3012. ⟨10.1109/JSSC.2012.2217851⟩. ⟨hal-00787388⟩

• Communication dans un congrès

A model for the reflection at a liquid-solid interface of ultrasonic waves radiated by a phased-array transducer

Nadir Maghlaoui, Mohamed Ourak, Wei-Jiang Xu, H. Djelouah, A. Oudina

11th Congrès Français d'Acoustique joint with 2012 Annual IOA Meeting, Acoustics 2012, 2012, Nantes, France. ⟨hal-00798854⟩

• Article dans une revue

Broadband and picosecond intraband absorption in lead based colloidal quantum dots

B. de Geyter, A.J. Houtepen, S. Carrillo, P. Geiregat, Y. Gao, S. ten Cate, J. M. Schins, D. van Thourhout, C. Delerue, L.D.A. Siebbeles, Z. Hens

ACS Nano, 2012, 6, pp.6067-6074. ⟨10.1021/nn301149x⟩. ⟨hal-00787436⟩

• Article dans une revue

Automatic radar target recognition of objects falling on railway tracks

A. Mroue, M. Heddebaut, F. Elbahhar, Atika Rivenq, Jean-Michel Rouvaen

Measurement Science and Technology, 2012, 23, pp.025401-1-10. ⟨10.1088/0957-0233/23/2/025401⟩. ⟨hal-00788180⟩

• Communication dans un congrès

Novel graphene-based high-performance surface plasmon resonance (SPR) biosensor

E. Wijaya, N. Maalouli, Rabah Boukherroub, Sabine Szunerits, Jean-Pierre Vilcot

2nd Workshop on Frontiers in Biological Detection, PLASMOBIO 2012, 2012, Mons, Belgium. ⟨hal-00797740⟩

• Communication dans un congrès

Study of rough surface to decrease reverberation noise in ultrasonic imaging

Jin-Ying Zhang, G. Han, S.M. Chen, Y. Qian, Wei-Jiang Xu, Julien Carlier, Bertrand Nongaillard

Rough back surface is investigated to decrease the reverberation noise in ultrasonic imaging. Silicon crystal is selected as the backing substrate of the ultrasonic transducer because rough structure is convenient to be fabricated on silicon substrate using microfabrication technologies. Different...

10th IEEE International New Circuits and Systems Conference, NEWCAS 2012, 2012, Montréal, QC, Canada. pp.509-512, ⟨10.1109/NEWCAS.2012.6329068⟩. ⟨hal-00803090⟩