Publicaciones

• Communication dans un congrès

Nanowires and nanocones for new nanostructured materials

D. Hourlier, P. Perrot

Thematic Days on Nanowires and Applications, GDR 2974, 2011, Villeneuve d'Ascq, France. ⟨hal-00591389⟩

• Communication dans un congrès

Atom probe investigation of silicon nanowires grown by VLS and IPSLS

W. M. Chen, P. Pareige, B. Grandidier, D. Stievenard, Lianbo Yu, Pere Roca I Cabarrocas

Thematic Days on Nanowires and Applications, GDR 2974, 2011, Villeneuve d'Ascq, France. ⟨hal-00591402⟩

• Article dans une revue

Mechanical characterization of aluminium nanofilms

Gregory Guisbiers, Etienne Herth, L. Buchaillot

The mechanical properties (Young’s modulus, hardness, wear resistance) of aluminium nanofilms on silicon substrate are studied. Size effect on these mechanical properties are exhibited. Young’s modulus, hardness and wear resistance increases when the thickness is reduced. Experimental...

Microelectronic Engineering, 2011, 88 (5), pp.844-847. ⟨10.1016/j.mee.2010.06.028⟩. ⟨hal-00579052⟩

• Communication dans un congrès

Far-field THz radiation pattern from photoconductive emitters on different substrates

J. Klier, S. Wohnsiedler, W. Zouaghi, Emilien Peytavit, Jean-Francois Lampin, J. Jonuscheit, R. Beigang

36th International Conference on Infrared, Millimeter and THz Waves, IRMMW-THz 2011, 2011, Houston, TX, United States. paper Th4E.4, 1-2, ⟨10.1109/irmmw-THz.2011.6104974⟩. ⟨hal-00800482⟩

• Communication dans un congrès

Squeezing radiation from quantum cascade lasers with leaky waves

Miguel Beruete, Tahsin Akalin, Miguel Navarro-Cia, Guillaume Ducournau, Jean-Francois Lampin, Mario Sorolla

Several flat antennas consisting of a central slot surrounded by a metallic periodic structure are proposed to enhance the radiation of quantum cascade laser terahertz sources. A simulation study of the optimal profile for high gain and radiation efficiency is done. Prototypes are being fabricated

36th International Conference on Infrared, Millimeter and THz Waves, IRMMW-THz 2011, Oct 2011, Houston, TX, United States. paper Tu3D.1, 1-2, ⟨10.1109/irmmw-THz.2011.6105066⟩. ⟨hal-00800485⟩

• Communication dans un congrès

Electron-phonon scattering in Si and Ge : from bulk to nanodevices

D. Rideau, W. Zhang, Y.M. Niquet, C. Delerue, C. Tavernier, H. Jaouen

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2011, 2011, Osaka, Japan. pp.47-50, ⟨10.1109/SISPAD.2011.6035046⟩. ⟨hal-00800089⟩

• Communication dans un congrès

CMOS digital tunable capacitance with tuning ratio up to 13 and 10dBm linearity for RF and millimeter-wave design

R. Debroucke, A. Pottrain, D. Titz, F. Gianesello, D. Gloria, C. Luxey, Christophe Gaquière

IEEE Radio Frequency Integrated Circuits Symposium, RFIC 2011, 2011, Baltimore, MD, United States. pp.1-4, ⟨10.1109/RFIC.2011.5940648⟩. ⟨hal-00800111⟩

• Communication dans un congrès

Dry etching process on a conducting interpenetrating polymer network actuator for a flapping fly micro robot

Alexandre Khaldi, Cedric Plesse, Caroline Soyer, Eric Cattan, F. Vidal, C. Chevrot, D. Teyssie

ASME 2011 International Mechanical Engineering Congress & Exposition, IMECE 2011, 2011, Denver, CO, United States. pp.IMECE2011-63505-1-3. ⟨hal-00800389⟩

• Communication dans un congrès

Fabrication and characterization of half-Kerfed LiNbO3-based high-frequency (>100MHz) ultrasonic array transducers

Jin-Ying Zhang, Wei-Jiang Xu, Julien Carlier, X.M. Ji, Bertrand Nongaillard, S. Queste, J. Zhou, Y.P. Huang

The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore,...

IEEE International Ultrasonics Symposium, IUS 2011, 2011, Orlando, FL, United States. pp.1727-1730, ⟨10.1109/ULTSYM.2011.0431⟩. ⟨hal-00800467⟩

• Article dans une revue

Fabrication of AD/DA microfluidic converter using deep reactive ion etching of silicon and low temperature wafer bonding

C. Wu, F. Bendriaa, F. Brunelle, V. Senez

Microelectronic Engineering, 2011, 88, pp.1878-1883. ⟨10.1016/j.mee.2010.12.001⟩. ⟨hal-00795913⟩