Publications
Affichage de 15061 à 15070 sur 16429
Fabrication of a pMUT using silicon bulk micromachining and a sputtered PZT layer
W. Daniau, Karim Dogheche, S. Ballandras, Eric Cattan, Denis Remiens, W. Steichen, P. Blind
Proc. of the 2nd WorkShop on MUT, Besançon, 2002, pp. june. ⟨hal-00123195⟩
Chapitre 5 : Micro-actionneurs en alliage à mémoire de forme
Nicolas Chaillet, L. Buchaillot, Joël Abadie, I. Roch, Christian Lexcellent
Microactionneurs électromagnétiques, électrostatiques et électroactifs, HERMES Science Publications, pp. 179-219, 2002, Collection EGEM (Electronique, Génie Electrique, Micro-technologies). ⟨hal-00092477⟩
Emission basse fréquence par interaction non-linéaire d'ondes ultrasonores
Philippe Pernod, Y. Pylnov, Vladimir Preobrazhensky
Actes du 6ème Congrès Français d'Acoustique, CFA 2002, 2002, Lille, France. ⟨hal-00148704⟩
Beam forming through the use of electromagnetic band gap materials
Tahsin Akalin, G. Wolf, S. Arscott, Xavier Mélique, Olivier Vanbésien, Eric Estebe, Didier Lippens
25th ESA Antenna Workshop, 2002, Noordwijk, Netherlands. ⟨hal-00148652⟩
Design production and testing of PMN-PT electrostrictive transducers
J. Coutte, Bertrand Dubus, J.C. Debus, C. Granger, D. Jones
Ultrasonics, 2002, 40, pp.883-888. ⟨hal-00147756⟩
Vacuum and cryogenic station for Micro-Electro-Mechanical Systems probing and testing
Bernard Legrand, E. Quévy, B. Stefanelli, D. Collard, L. Buchaillot
Review of Scientific Instruments, 2002, 73, pp.4393-4395. ⟨hal-00148782⟩
Microcapteurs de rayonnement infrarouge en technologie silicium
Mohamed Boutchich
2002. ⟨hal-00148731⟩
Characterization of phosphorus and boron heavily doped LPCVD polysilicon films in the temperature range 293-373K
Mohamed Boutchich, Katir Ziouche, Pascale Godts, Didier Leclercq
IEEE Electron Device Letters, 2002, 23 (3), pp.139-141. ⟨10.1109/55.988817⟩. ⟨hal-00148729⟩
Measurement of the elastic and viscoelastic properties of dielectric films used in microelectronics
G. Carlotti, P. Colpani, D. Piccolo, S. Santucci, V. Senez, G. Socino, L. Verdini
Thin Solid Films, 2002, 414, pp.99-104. ⟨hal-00148744⟩
Reliability of packaging MEMS in shock environment : crack and stiction modeling
O. Millet, D. Collard, L. Buchaillot
2002, pp.696-703. ⟨hal-00148789⟩