Publications
Affichage de 10821 à 10830 sur 16182
High modal bandwidth glass multimode fibers used for the simultaneous transmission of 10GbE and band group 5 MB-OFDM ultra-wide band signals
C. Lethien, Christophe Loyez, Jean-Pierre Vilcot, P.A. Rolland
European Workshop on Photonic Solutions for Wireless, Access and in-house Networks, 2009, Duisburg, Germany. ⟨hal-00574848⟩
InAlN-based HEMT for microwave applications
S.L. Delage, C. Giesen, M. Heuken, B. Schineller, M.A. Di Forte-Poisson, C. Dua, J.C. Jacquet, E. Morvan, N. Sarazin, J.F. Carlin, M. Gonschorek, N. Grandjean, M. Py, A. Georgakilas, E. Iliopoulos, G. Konstantinidis, K. Cico, K. Fröhlich, Jean-Claude de Jaeger, Christophe Gaquière, E. Kohn
ESA/MOD Workshop on GaN Microwave Component Technologies, 2009, Germany. pp.66-75. ⟨hal-00573164⟩
Optimisation d'une source vibratoire pour la détection des cavités souterraines par sismique réflexion haute résolution
Arkadiusz Kosecki
2009. ⟨hal-00573114⟩
Conception et réalisation d'antennes en bande millimétrique à base de MEMS RF pour des applications télécoms et en contrôle non destructif
Etienne Herth
2009. ⟨hal-00573107⟩
A millimeter-wave microstrip antenna array on ultra-flexible micromachined polydimethylsiloxane (PDMS) polymer
S. Hage-Ali, Nicolas Tiercelin, P. Coquet, R. Sauleau, H. Fujita, Vladimir Preobrazhensky, Philippe Pernod
IEEE Antennas and Wireless Propagation Letters, 2009, 8, pp.1306-1309. ⟨10.1109/LAWP.2009.2037590⟩. ⟨hal-00469645⟩
Vortices and ferroelectric switching dynamics
Anaïs Sené, Igor A. Luk'Yanchuk, Laurent Baudry, Laurent Lahoche
2nd International Meeting on Materials for Electronic Applications, IMMEA 2009, 2009, Hammamet, Tunisia. ⟨hal-00575711⟩
Mie resonance-based dielectric metamaterials
Q. Zhao, J. Zhou, F. Zhang, D. Lippens
Materials Today, 2009, 12, pp.60-69. ⟨10.1016/S1369-7021(09)70318-9⟩. ⟨hal-00471883⟩
Experimental study on sound and damaged mortar: Variation of ultrasonic parameters with porosity
Zoubeir Lafhaj, Marc Goueygou
Construction and Building Materials, 2009, 23 (2), pp.953-958. ⟨10.1016/j.conbuildmat.2008.05.012⟩. ⟨hal-00354607⟩
Novel bondpad report process for III-V semiconductor devices using full HSQ properties
Malek Zegaoui, Nargess Choueib, P. Tilmant, Marc François, Christiane Legrand, Jean Chazelas, Didier Decoster
Microelectronic Engineering, 2009, 86 (1), pp.68-71. ⟨10.1016/j.mee.2008.09.043⟩. ⟨hal-00473043⟩
Self-assembled monolayers for electrode fabrication and efficient threshold voltage control of organic transistors
C. Celle, C. Suspene, J.P. Simonato, S. Lenfant, M. Ternisien, D. Vuillaume
Organic Electronics, 2009, 10, pp.119-126. ⟨10.1016/j.orgel.2008.10.007⟩. ⟨hal-00472766⟩