Publications

Affichage de 12511 à 12520 sur 16093


  • Communication dans un congrès

Recherche des propriétés d'atténuation électromagnétique de matériaux polymères conducteurs déposés en couches minces

L. Kone, N. Ben Slimen, S. Baranowski, B. Demoulin, J.L. Wojkiewicz, N.N. Hoang

2006, pp.110-112. ⟨hal-00142608⟩

  • Communication dans un congrès

On the efficiency of several active materials used for vibration damping

Anne-Christine Hladky, C. Granger, M. Phamthi

2006, pp.1128-1131. ⟨hal-00147505⟩

  • Communication dans un congrès

Fabrication of 1mm3 size zero-level packaging using wafer-level BCB bonding and glass wet-etching technique for devices MEMS

S. Seok, N. Rolland, P.A. Rolland

2006, pp.53-54. ⟨hal-00147518⟩

  • Communication dans un congrès

Dielectrophoresis, cell culture, and electrical impedance spectroscopy applied to adherent cells in a single biochip

E. Lennon, S. Ostrovidov, V. Senez, T. Fujii

2006, 4 pp. ⟨hal-00147726⟩

  • Communication dans un congrès

A co-operative radar system for collision avoidance and communications between vehicles

C. Tatkeu, P. Deloof, Yassin El Hillali, Atika Rivenq, Jean-Michel Rouvaen

2006, pp.1012-1016. ⟨hal-00147738⟩

  • Article dans une revue

An open design microfabricated nib-like nanoelectrospray emitter tip on a conducting silicon substrate for the application of the ionization voltage

Séverine Gac, Christian Rolando, S. Arscott

Journal of The American Society for Mass Spectrometry, 2006, 17 (1), pp.75-80. ⟨10.1016/j.jasms.2005.09.003⟩. ⟨hal-02347490⟩

  • Communication dans un congrès

Multihop wireless communications with non regenerative relays

A. Bendjaballah, H. El Ghannudi, Laurent Clavier, N. Rolland, P.A. Rolland

2006, 4 pp. ⟨hal-00152956⟩

  • Communication dans un congrès

65 nm RFCMOS technologies with bulk and HR SOI substrate for millimeter wave passives and circuits characterized up to 220 GHz

F. Gianesello, D. Gloria, S. Montusclat, C. Raynaud, S. Boret, C. Clement, S. Dambrine, Sylvie Lepilliet, F. Saguin, P. Scheer, P. Benech, J.M. Fournier

2006, 4 pp. ⟨hal-00154919⟩

  • Communication dans un congrès

State of the art 200 GHz passive components and circuits integrated in advanced thin SOI CMOS technology on high resistivity substrate

F. Gianesello, D. Gloria, C. Raynaud, S. Montusclat, S. Boret, C. Clement, P. Benech, J.M. Fournier, Gilles Dambrine

2006, pp.121-122. ⟨hal-00154918⟩