Publications

Affichage de 3611 à 3620 sur 16064


  • Communication dans un congrès

A discrete-to-continuum approach to frequency bangaps in 1D biatomic metamaterials

L. Placidi, A. Amendola, M. Miniaci, F. Fraternali

XI International Conference on Structural Dynamic, EURODYN 2020, Nov 2020, Athens, Greece. pp.604-611, ⟨10.47964/1120.9047.21606⟩. ⟨hal-03135964⟩

  • Autre publication scientifique

Advances in Historical Studies [Editor in Chief 9/3]

Raffaele Pisano

2020. ⟨hal-04510983⟩

  • Communication dans un congrès

Millimeter wave carbon nanotube based flip chip coplanar interconnects

Joseph de Saxce, Philippe Roux-Levy, Chun Fei Siah, Jianxiong Wang, Beng Kang Tay, Philippe Coquet, Dominique Baillargeat

In this work, we investigate the performances of vertically aligned carbon nanotube (VACNT) arrays for high frequency interconnects. The frequency range of this study is the W band (75 GHz to 110 GHz). The type of interconnect is coplanar, meaning the interconnect can connect two subparts…

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), Dec 2020, Singapore, Singapore. pp.81-84, ⟨10.1109/EPTC50525.2020.9314999⟩. ⟨hal-03140965⟩

  • Article dans une revue

Plasmonic-based sensitivity enhancement of a Goos-Hanchen shift biosensor using transition metal dichalcogenides: a theoretical insight

Guo Y, Singh Nm, Das Cm, Ouyang Ql, Kang Lx, Li Kb, Philippe Coquet, Yong Kt

New Journal of Chemistry, 2020, 44 (37), pp.16144-16151. ⟨10.1039/d0nj01890b⟩. ⟨hal-03091467⟩

  • Communication dans un congrès

Electrothermal modeling of GaN power transistor for high frequency power converter design

Loris Pace, Florian Chevalier, Arnaud Videt, N. Defrance, Nadir Idir, Jean-Claude de Jaeger

This work proposes the electrothermal modeling of a packaged GaN power transistor in order to evaluate by simulation its performances in a 200 W - 1 MHz DC/DC converter. The complete electrical modeling of the high frequency converter using EM-circuit co-simulations is presented. After validation…

22nd European Conference on Power Electronics and Applications (EPE ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215782⟩. ⟨hal-03276912⟩