Publications

Affichage de 5441 à 5450 sur 16075


  • Ouvrages

Un racconto di sette elementi (A Tale of Seven Eelements by Eric Scerri, Oxford University Press, Oxford)

Raffaele Pisano, Paolo Bussotti, Eric Scerri

2017, 978-88-255-0424-8. ⟨hal-04517856⟩

  • Article dans une revue

Copper oxide supported on three-dimensional ammonia-doped porous reduced graphene oxide prepared through electrophoretic deposition for non-enzymatic glucose sensing

Houcem Maaoui, Santosh Singh, Florina Teodorescu, Yannick Coffinier, Alexandre Barras, Alexandr Barras, Radhouane Chtourou, Sreekumar Kurungot, Sabine Szunerits, Rabah Boukherroub

Electrochimica Acta, 2017, 224, pp.346-354. ⟨10.1016/j.electacta.2016.12.078⟩. ⟨hal-04520463⟩

  • Communication dans un congrès

Microstructuration of Silicon Surfaces Using Nanoporous Gold Electrodes

E Torralba, Mathieu Halbwax, T El Assimi, V. Magnin, Joseph Harari, Jean-Pierre Vilcot, Sylvain Le Gall, Raphaël Lachaume, C Cachet-Vivier, Stéphane Bastide

Etching is a key process in the fabrication of silicon (Si) microstructures that are essential for several component families used in microelectronics, photonics and photovoltaics, among others. A large variety of microstructuring technologies exists nowadays (e.g. wet/dry etchings based on photo/…

21st Topical Meeting of the International Society of Electrochemistry, ISE, Apr 2017, Szeged, Hungary. pp.31375 - 31375. ⟨hal-01537684⟩

  • Autre publication scientifique

Advances in Historical Studies [Editor in Chief 6/4]

Raffaele Pisano

2017. ⟨hal-04511010⟩

  • Article dans une revue

International Summer School, Lille Report

Raffaele Pisano

Viewpoint, 2017, 110 (6), pp.13-14. ⟨hal-04509329⟩

  • Article dans une revue

3D patterning of silicon by contact etching with anodically biased nanoporous gold electrodes

Encarnación Torralba, Mathieu Halbwax, Taha El Assimi, Marin Fouchier, Vincent Magnin, Joseph Harari, Jean-Pierre Vilcot, Sylvain Le Gall, Raphaël Lachaume, Christine Cachet-Vivier, Stéphane Bastide

A novel strategy to achieve 3D pattern transfer into silicon in a single step without using lithography is presented. Etching is performed electrochemically in HF media by contacting silicon with a positively biased, patterned, metal electrode. Dissolution is localized at the Si/metal contacts and…

Electrochemistry Communications, 2017, 76, pp.79-82. ⟨10.1016/j.elecom.2017.01.014⟩. ⟨hal-01480682⟩