11th International Conference on Future Networks and Communications, FNC 2016 / 13th International Conference on Mobile Systems and Pervasive Computing, MobiSPC 2016, Aug 2016, Montreal, Canada. pp.272-279, ⟨10.1016/j.procs.2016.08.041⟩. ⟨hal-03528687⟩

Article dans une revue

Wetting characterization of high aspect ratio nanostructures by gigahertz acoustic reflectometry

Christophe Virgilio, Julien Carlier, Pierre Campistron, Malika Toubal, Philippe Garnier, L. Broussous, V. Thomy, Bertrand Nongaillard

Wetting efficiency of microstructures or nanostructures patterned on Si wafers is a real challenge in integrated circuits manufacturing. In fact, bad or non-uniform wetting during wet processes limits chemical reactions and can lead to non-complete etching or cleaning inside the patterns and device…

International Journal of Mechanical and Mechatronics Engineering, 2016, 10 (3), pp.413-418. ⟨hal-03560404⟩

Communication dans un congrès

In-situ solder surface tension measurements using mechanical resonances

Assane Ndieguene, Jean-Francois Morissette, Nathalie Normand, Julien Sylvestre

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2016, Montpellier, France. ⟨10.1109/EuroSimE.2016.7463343⟩. ⟨hal-01927506⟩

Communication dans un congrès

Outil d'analyse temps-fréquence adapté aux problématiques CEM du milieu ferroviaire

Mohammed Raouf Kousri, Virginie Deniau, Marc Heddebaut, S. Baranowski

L'environnement ferroviaire est caractérisé par un grand nombre de sources d'émissions électromagnétiques produisant des signaux de caractéristiques très variées. En parallèle, la variété des systèmes vulnérables de signalisation, de communication, de localisation... embarqués à bord des…

18ème Colloque International et Exposition sur la Compatibilité ÉlectroMagnétique (CEM 2016), Jul 2016, Rennes, France. 6p. ⟨hal-01373445⟩

Communication dans un congrès

Metal/insulator/semiconductor contacts for ultimately scaled CMOS nodes: projected benefits and remaining challenges

Julien Borrel, Louis Hutin, Helen Grampeix, Emmanuel Nolot, Magali Tessaire, Guillaume Rodriguez, Yves Morand, Fabrice Nemouchi, Magali Gregoire, Emmanuel Dubois, Maud Vinet

In this paper, some key fundamental aspects of Metal / Insulator / Semiconductor contacts as well as practical issues occurring with their implementation are reviewed in order to fully comprehend the opportunities and limitations of this approach.

IWJT 2016 - 16th International Workshop on Junction Technology, May 2016, Shanghai, China. pp.14-19. ⟨hal-03325000⟩

Article dans une revue

On-chip and freestanding elastic carbon films for micro-supercapacitors

Peihua Huang, Christophe Lethien, Sébastien Pinaud, Kevin Brousse, Raphaël Laloo, Viviane Turq, Marc Respaud, Arnaud Demortiere, Barbara Daffos, Pierre-Louis Taberna, Bruno Chaudret, Yury Gogotsi, Patrice Simon

Integration of electrochemical capacitors with silicon-based electronics is a major challenge, limiting energy storage on a chip. We describe a wafer-scale process for manufacturing strongly adhering carbide-derived carbon films and interdigitated micro-supercapacitors with embedded titanium…

Science, 2016, 351 (6274), pp.691-695. ⟨10.1126/science.aad3345⟩. ⟨hal-01489186⟩

Communication dans un congrès

Polarimetric indoor measurements at 94 GHz

Maria-Teresa Martinez-Ingles, Jose-Maria Garcia-Pardo, Davy Gaillot, Juan Pascual-Garcia, Jose-Victor Rodriguez, Leandro Llacer, M. Lienard

10th European Conference on Antennas and Propagation, EuCAP 2016, Apr 2016, Davos, Switzerland. 3 p., ⟨10.1109/EuCAP.2016.7481453⟩. ⟨hal-03346248⟩