Publications

Affichage de 6261 à 6270 sur 16075


  • Communication dans un congrès

Forward V-band Vector Network Analyzer Based on a Modified Six-port Technique

Kamel Haddadi, Tuami Lasri

A V-band forward network analyzer based on a modified six-port technique is proposed for the measurement of complex reflection (S-11) and transmission (S-21) coefficients. The millimeter-wave part of the system is implemented on a thin alumina ceramic substrate. The measurement performance is…

2015 IEEE Topical Conference on Wireless Sensors and Sensor Networks, WiSNet 2015, 9th IEEE Radio & Wireless Week, RWW 2015, Jan 2015, San Diego, CA, États-Unis. pp.23-25, ⟨10.1109/WISNET.2015.7127400⟩. ⟨hal-03224666⟩

  • Article dans une revue

Ultrasonic Tomography of Nonmixing Fluid Flows

P I Pyl 'Nov, P I Krutyansky, V I Kutlubaeva, Farzam Zoueshtiagh, P I Chainais, V I Herman, Philippe Pernod

An ultrasonic method for simultaneous measurement of two-dimensional distributions of compositions and flow velocities in a system of two nonmixing fluids is proposed and implemented. The method is based on tomographic reconstruction of images of scalar and vector objects using a rectangular system…

Physics of Wave Phenomena, 2015, 23, pp.273 - 278. ⟨10.3103/S1541308X15040056⟩. ⟨hal-01433710⟩

  • Communication dans un congrès

Negative differential resistance and non-volatile memory in hybrid redox organic/nanoparticle devices.

Tiantian Zhang, David Guérin, Stéphane Lenfant, Dominique Vuillaume, F. Alibart, Kamal Lmimouni, Ali Yassin, Maiténa Oçafrain, Jean Roncali, Philippe Blanchard

EMRS Spring meeting Lille, 2015, Lille, France. ⟨hal-02564030⟩

  • Communication dans un congrès

Characterization of flexible CMOS technology tranferred onto a metallic foil

Justine Philippe, Aurelien Lecavelier Des Etangs-Levallois, Philip Latzel, Francois Danneville, J.F. Robillard, Daniel Gloria, Emmanuel Dubois

In this work we demonstrate a method to transfer high-performance industrial CMOS circuits thinned down to 5.7 mu m and bond onto a 25-mu m-thick stainless steel foil with a 800-nm-thick indium layer. The bonding is performed at the temperature of 100 degrees C with an applied pressure of 1.2 bar.…

2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, Jan 2015, Bologna, Italy. ⟨10.1109/ULIS.2015.7063747⟩. ⟨hal-03272691⟩

  • Communication dans un congrès

QAM-32/0.588 THz communication using electronic Schottky transceivers

Guillaume Ducournau, Pascal Szriftgiser, Denis Bacquet, Emilien Peytavit, Mohammed Zaknoune, Rédha Kassi, Jean-Francois Lampin

We report on THz communication system using vectorial modulations schemes above 500 GHz. Using schottky-based electronic technologies at 588 GHz, potentialities of high-level multi-carrier modulation schemes for wireless links are analyzed. The wireless link is composed of an emitter with sub-…

40th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Aug 2015, Hong Kong, Hong Kong SAR China. ⟨10.1109/IRMMW-THz.2015.7327665⟩. ⟨hal-03286182⟩

  • Communication dans un congrès

Semi-digital FIR DAC for low power single carrier IEEE 802.11ad 60GHz transmitter

Fikre Tsigabu Gebreyohannes, Antoine Frappé, Andreas Kaiser

IEEE 802.11ad (WiGig) is an emerging multi-Gb/s wireless standard in the unlicensed 60GHz spectrum. This work presents system level validation of a Single Carrier (SC), QPSK modulated WiGig transmitter based on a semi-digital Finite Impulse Response (FIR) Digital-to-Analog Converter (DAC). The 1.…

2015 IEEE 13th International New Circuits and Systems Conference (NEWCAS), Jun 2015, Grenoble, France. pp.1-4, ⟨10.1109/NEWCAS.2015.7182016⟩. ⟨hal-03377047⟩