Publicaciones

Affichage de 2801 à 2810 sur 16064


  • Communication dans un congrès

Une plateforme expérimentale «asmartgrid» pour l'apprentissage du génie électrique en cycle ingénieur

Fabrice Lefebvre, B Piton, M Bricout

14ème Colloque Enseignement des Technologies et des Sciences de l'Information et des Systèmes, CETSIS 2021, Jun 2021, Valenciennes (Virtuel), France. pp.310-316. ⟨hal-03582513⟩

  • Communication dans un congrès

Une application comparative pour l'enseignement des méthodes de compression d'images par transformées orthogonales

M Gharbi, Mohamed Aymen Labiod

14ème Colloque Enseignement des Technologies et des Sciences de l'Information et des Systèmes, CETSIS 2021, Jun 2021, Valenciennes (Virtuel), France. pp.219-223. ⟨hal-03573163⟩

  • Communication dans un congrès

A Fully-Digital 0.1-to-27 Mb/s ULV 450 MHz Transmitter with sub-100 µW Power Consumption for Body-Coupled Communication in 28 nm FD-SOI CMOS

Guillaume Tochou, Robin Benarrouch, David Gaidioz, Andreia Cathelin, Antoine Frappé, Andreas Kaiser, Jan Rabaey

A 0.5 V fully-digital 450 MHz transmitter for surface wave capacitive body-coupled communications is realized in 28 nm FD-SOI CMOS and consumes 17 to 76 µW for data rates from 0.1 to 27 Mb/s with up to 14 % system efficiency. The heavily duty-cycled transmitter uses a 90 MHz free-running oscillator...

2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC/IMS), Jun 2021, Atlanta, United States. pp.195-198, ⟨10.1109/rfic51843.2021.9490464⟩. ⟨hal-03306898⟩

  • Communication dans un congrès

Plastic Microwave Fibers at Millimeter-wave and THz Frequencies as a Low Cost Data Link

Joren Vaes, Kristof Dens, Guillaume Ducournau, Patrick Reynaert

A chip-to-chip, board-to-board or module-to-module interconnect is presented that offers over 100 Gbit/s datarates at a cost of a few cents per link based on polymer microwave fiber technology. The link uses a PTFE core with air cladding, connected using plastic metal-waveguide flanges. This work...

2021 IEEE/MTT-S International Microwave Symposium - IMS 2021, Jun 2021, Atlanta, United States. pp.589-591, ⟨10.1109/IMS19712.2021.9574897⟩. ⟨hal-03540988⟩

  • Poster de conférence

Approximation analytique du faisceau de fuite d’un déflecteur électro-optique à base d’un guide sur polymères

Pierre-Vincent Dugué, Mohammed El Gibari, Christian Larat, Kevin Heggarty, Jean-Pierre Vilcot, Hongwu Li

JCOM 2021, Jun 2021, Paris, France. ⟨hal-03512149⟩

  • Communication dans un congrès

220 GHz E-Plane Transition from Waveguide to Suspended Stripline Integrated on Industrial Organic Laminate Substrate Technology

Victor Fiorese, F. Laporte, J.F. Caillet, G. Catalano, F. Gianesello, Guillaume Ducournau, Emmanuel Dubois, Christophe Gaquière, B. Tricoteaux, M. Werquin, D. Gloria

In this paper, an assessment up to 220 GHz of industrial organic laminate substrate technology to integrate millimeter-wave (mmW) waveguide to suspended stripline (SSL) transition is proposed. A WR5 waveguide transition has been manufactured and insertion loss (IL) of 1.4 dB @ 140 GHz and 4.2 dB @...

European Microwave Conference, EuMC 2021, Session EuMC06 - 3D to 2D Transitions and New Materials for mmWave system Integration, EuMIC/EuMC/EuMW, Apr 2021, London, United Kingdom. pp.99-102, ⟨10.23919/EuMC50147.2022.9784166⟩. ⟨hal-03637651⟩

  • Communication dans un congrès

Optimization of PCM based thermal management device for power electronics using an effective thermal conductivity model for architected enhancers

Romain Hubert, Olivier Bou Matar, Jerome Foncin, Philippe Coquet, Dunlin Tan, Hongling Li, Jong Jen Yu, Edwin Hang Tong Teo, Thomas Merlet, Philippe Pernod

Phase Change Material (PCM) have been widely used for thermal energy storage due to their high latent heat of fusion. Several types of PCM are available and can be selected to meet the required melting temperature and latent heat value. However their low thermal conductivity drastically reduces...

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), Jun 2021, San Diego, United States. pp.452-459, ⟨10.1109/ITherm51669.2021.9503251⟩. ⟨hal-03501647⟩