Publications

• Communication dans un congrès

Blind channel equalization in down-link MC-CDMA systems exploiting guard interval redundancy and excess codes

D.A. Bouzidi, K. Abed-Meriam, A. Djebbari, Jean-Michel Rouvaen

7th IEEE International Workshop on Signal Processing Advances in Wireless Communications, SPAWC 2006, 2006, France. pp.557-561, ⟨10.1109/SPAWC.2006.346420⟩. ⟨hal-00247414⟩

• Article dans une revue

TEM study of iridium silicide contact layers for low Schottky barrier MOSFETs

A. Laszcz, A. Czerwinski, J. Ratajczak, J. Katcki, N. Breil, G. Larrieu, Emmanuel Dubois

An influence of annealing temperatures (300, 400 and 500°C) on the iridium silicide formation in the Ir/Si structure was analysed by means of the transmission electron microscopy (TEM). The silicide layer is formed by the solid-state reaction b etween 15 nm thick Ir metallisation and a Si layer…

Archives of Metallurgy and Materials, 2006, 51 (4), pp.551-554. ⟨hal-00152968⟩

• Communication dans un congrès

Design, analysis and fabrication of high frequency piezoelectric transducers

Anne-Christine Hladky, J.C. Debus, Bertrand Dubus, F. Duval, C. Granger, P. Mosbah, Jamal Assaad, Sébastien Grondel, Eric Cattan, E.E. Newnham

Polecer International Conference, Piezoceramics for end-users II, 2006, Lillehammer, Norway. ⟨hal-00126491⟩

• Article dans une revue

Strain determination in MBE-grown InAs quantum wires on InP

A. Mazuelas, L. Gonzalez, J. M. Garcia, Y. Gonzalez, T. Schuelli, C. Priester, H. T. Metzger

Physical Review B: Condensed Matter and Materials Physics (1998-2015), 2006, 73, pp.045312-1-6. ⟨hal-00127060⟩

• Communication dans un congrès

Victim and Aggressor Line Electrical Modelisation in an Multicoupled Interconnect Environment for Transient Simulation

Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht

An electrical modelisation of eight lossy Cu interconnects is proposed thanks to the implementation of a vector finite element method. This full wave analysis gives frequency dependence of proper or mutual inductance, capacitance or resistance from resulting transmission line equations system.…

SPI: Signal Propagation on Interconnects, May 2006, Berlin, Germany. pp.249-251, ⟨10.1109/SPI.2006.289235⟩. ⟨lirmm-00102776⟩

• Article dans une revue

Coupled-resonator micromechanical filters with voltage tuneable bandpass characteristic in thick-film polysilicon technology

Dimitri Galayko, Andreas Kaiser, Bernard Legrand, Lionel Buchaillot, Dominique Collard, Chantal Combi

This paper reports on the design and characterization of 2.4 and 9.2 MHz fourth and sixth order passband microelectromechanical coupled-resonator filters implemented in a 15 μm thick-film epitaxial polysilicon technology. The work uses a novel approach in the building of coupled-resonator…

Sensors and Actuators A: Physical , 2006, 126 (1), pp.227-240. ⟨10.1016/j.sna.2005.10.033⟩. ⟨hal-01195973⟩

• Article dans une revue

Nonlinear electrical properties of three-terminal junctions

D. Wallin, I. Shorubalko, H.Q. Xu, A. Cappy

Applied Physics Letters, 2006, 89, pp.092124-1-3. ⟨hal-00126525⟩

• Article dans une revue

Influence of the deposition parameters on the texture of boron nitride thin films synthesized in a microwave plasma-enhanced reactor

P. Thévenin, M. Eliaoui, A. Ahaitouf, A. Soltani, A. Bath

Surface and Coatings Technology, 2006, 200, pp.6444-6448. ⟨hal-00127946⟩

• Communication dans un congrès

Electrostatic actuators operating in liquid environment: suppression of pull-in instability and dynamic response

A.S. Rollier, M. Faucher, Bernard Legrand, D. Collard, L. Buchaillot

2006, pp.244-249. ⟨hal-00128674⟩

• Article dans une revue

Traps centers and deep defects contribution in current instabilities for AlGaN/GaN HEMT's on silicon and sapphire substrates

N. Sghaier, M. Trabelsi, N. Yacoubi, J.M. Bluet, A. Souifi, G. Guillot, Christophe Gaquière, Jean-Claude de Jaeger

Microelectronics Journal, 2006, 37, pp.363-370. ⟨hal-00127942⟩