Publications

• COMM

[Invited] Heat transfer in silicon nano-membranes: application to thermoelectricity

J.F. Robillard, Hafsa Ikzibane, Antonin Massoud, Valeria Lacatena, Maciej Haras, Stanislav Didenko, Stephane Monfray, Jean-Marie Bluet, Pierre-Olivier Chapuis, Emmanuel Dubois

The 20th international symposium on the Physics of Semiconductors and Applications (ISPSA20), Jul 2022, Jaeju, South Korea. ⟨hal-04088371⟩

• ART

Lightweight sound-absorbing metastructures with perforated fish-belly panels

Yabin Jin, Yilong Yang, Zhihui Wen, Liangshu He, Yu Cang, Bin Yang, Bahram Djafari-Rouhani, Yong Li, Yan Li

We propose a perforated metastructure combining fish-belly panels and a corrugated sandwich structure for broadband sound absorption. The curved panels provide a new degree of freedom for sound absorption while the sandwich structure ensures a very good mechanical strength. We develop an effective…

International Journal of Mechanical Sciences, 2022, 226, pp.107396. ⟨10.1016/j.ijmecsci.2022.107396⟩. ⟨hal-03697672⟩

• COMM

Sensitivity analysis of residuals for soft fault monitoring in Y-shaped networks

Abdelkarim Abdelkarim, Virginie Degardin, Vincent Cocquempot

Networks, mainly composed of cables, are prone to failures. Faults in cables are initially benign (so-called soft faults) and then evolve over time to a much more severe form of faults as short or open circuits (so-called hard faults). It is thus of prime importance to detect and localize…

The 6th International Conference on Control, Automation and Diagnosis (ICCAD'22), Jul 2022, Lisbon, Portugal. ⟨hal-03726453⟩

• OTHER

[Tutorial] Microfabrication of THz on-wafer calibration kits and nanorobotics on-wafer probing station

Kamel Haddadi

TEMMT Project Training Courses, 2022. ⟨hal-03748356⟩

• COMM

Atomic force microscopy as a suitable tool for probing the polar axis direction in electroactive P(VDF-co-TrFE) films at the nanoscale

M.M. Saj Mohan, Antonio Da Costa, Jean-François Tahon, Vincent Bouad, Ahmad Hamieh, Ahmed Addad, Adeline Marin, Frédéric Cazaux, Freddy Ponchel, Jean-Marc Lefebvre, Vincent Ladmiral, Denis Remiens, Rachel Desfeux, Sophie Barrau, Anthony Ferri

Matériaux Électroactifs et Applications (MatElec 2022), Jul 2022, Villeneuve d'Ascq, France. ⟨hal-03956501⟩

• COMM

A New Approach to Improve the Control of the Sensitive Layer of Surface Acoustic Wave Gas Sensors Using the Electropolymerization

Zakariae Oumekloul, Sébastien Pecqueur, Arnaud de Maistre, Philippe Pernod, Kamal Lmimouni, Abdelkrim Talbi, B. Hafsi

Surface acoustic waves (SAWs) have a broad spectrum of applications, especially in sensing. However, deposition methods of sensitive layers can be controlled locally through electrodeposition unlike other conventional methods, such as drop-casting and atmospheric-pressure plasma. Employing this…

2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Jul 2022, Pont-a-Mousson, France. pp.1-4, ⟨10.1109/DTIP56576.2022.9911737⟩. ⟨hal-03871596⟩

• COMM

Étude de l'adhésion interfaciale dans les composites piézoélectriques à matrice fluoropolymère

Vincent Bouad, M.M. Saj Mohan, Alexandre Fadel, Ahmad Hamied, Adeline Marin, Jean-François Tahon, Ahmed Addad, Anthony Ferri, Antonio Da Costa, Rachel Desfeux, Freddy Ponchel, Denis Remiens, Joël Lyskawa, Jean-Marc Lefebvre, Sophie Barrau, Vincent Ladmiral

Matériaux Électroactifs et Applications (MatElec 2022), Jul 2022, Villeneuve d'Ascq, France. ⟨hal-03956612⟩

• COMM

[Invited] Last advances in sputtered nitride films as high performance pseudocapacitive electrodes for solid-state micro-supercapacitors

Christophe Lethien, Pascal Roussel, Thierry Brousse, Bruce Dunn

International Symposium on Enhanced Electrochemical Capacitors (ISE ECap 2022), Jul 2022, Bologne, Italy. ⟨hal-04304461⟩

• COMM

Realization of MEMS flush-mounted integration using Through Silicon Vias on thermal micro-sensors designed for aeronautics

A. Mazzamurro, Cécile Ghouila-Houri, T. Arnoult, Abdelkrim Talbi, Philippe Pernod

This paper reports the realization of Through Silicon Vias (TSV) filled with electrodeposited copper (Cu) for the fabrication of aeronautics dedicated thermal MEMS (Micro Electro-Mechanical Systems) sensors. The micro-sensors are designed to measure the skin friction of the airflow on a structure.…

2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Jul 2022, Pont-a-Mousson, France. pp.1-3, ⟨10.1109/DTIP56576.2022.9911714⟩. ⟨hal-03871498⟩

• POSTER

Influence des matériaux 2D sur la cristallisation et les propriétés ferroélectriques et piézoélectriques de films minces de P(VDF-TrFE)

Kevin Dalla Francesca, W. Jahjah, Antonio da Costa, Abir Nachawaty, X. Devaux, Jean-Christophe Le Breton, Philippe Schieffer, Rachel Desfeux, Yuan Lu, Anthony Ferri

Matériaux Électroactifs et Applications (MatElec 2022), Jul 2022, Villeneuve d'Ascq, France. ⟨hal-04277640⟩