Publications

• Communication dans un congrès

A New Storage-Less Hardware Compression Technique for Convolution Neural Networks Using Constant Multiplication.

Mohamed Ayoub Neggaz, Ihsen Alouani, Smail Niar, Fadi Kurdahi

WAICA: Workshop on Artificial Intelligence and Computer Architecture in Conjunction with HiPeac conference'20, Jan 2020, Bologne, Italy. ⟨hal-03389472⟩

• Communication dans un congrès

Time-frequency characterization of sonar transducers in support to design

Manell Zakharia, Bertrand Dubus, Philippe Plantevin

Commonly used in ultrasonic pulse imaging, wideband transducers are becoming more and more popular in sonar area in various areas of application where the time resolution is a paramount issue such as: estimation of time of flight, communication, high resolution imaging, impedance and attenuation…

e-Forum Acusticum 2020, Dec 2020, Lyon, France. pp.1575-1579, ⟨10.48465/fa.2020.1016⟩. ⟨hal-03231996⟩

• Article dans une revue

Progress in understanding structure and transport properties of PEDOT-based materials: a critical review

Magatte N. Gueye, Alexandre Carella, Jérôme Faure-Vincent, Renaud Demadrille, Jean-Pierre Simonato

Progress in Materials Science, 2020, 108, pp.100616. ⟨10.1016/j.pmatsci.2019.100616⟩. ⟨hal-03140624⟩

• Communication dans un congrès

Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding

Solene Bossut, Arnaud Devos, S Lhostis, E Deloffre, C Euvrard, F Dettoni, C Chaton

Nowadays, microelectronics is making progress in miniaturization and diversification of chips by 3D integration: dies are stacked together to gain space and performances. The stacking used here is called hybrid bonding [1], as stacked surfaces are heterogeneous: part Cu and part oxide. After the…

Forum Acusticum, Dec 2020, Lyon, France. pp.2553-2554, ⟨10.48465/fa.2020.0878⟩. ⟨hal-03240341⟩

• Article dans une revue

Utilisation du silicium nanostructuré dans un générateur thermoélectrique pour la réduction des pertes thermiques

Katir Ziouche, Ibrahim Bel-Hadj, Zahia Bougrioua

Dans cet article, nous présentons des microgénérateurs thermoélectriques (μTEG) planaires réalisés en technologie Silicium compatible CMOS, et destinés à la récupération de toute forme d’énergie thermique. Ceux-ci utilisent des matériaux faible coût, abondants et respectueux de l’environnement. La…, In this paper, we present a planar thermoelectric microgenerator (μTEG) based on CMOS-compatible silicon technology to harvest all forms of thermal energy. These have made by using low cost, abundant and eco-friendly materials. The heat harvesting has performed with a silicon concentrator. The…

Entropie : thermodynamique – énergie – environnement – économie, 2020, 1 (1), 10 p. ⟨10.21494/ISTE.OP.2020.0493⟩. ⟨hal-02906722⟩

• Communication dans un congrès

Effects of the electrical limit conditions on the electromechanical behavior of piezoelectric transducer arrays

Abdelmajid Bybi, Adil Ammar, Mohammed Garoum, Sébastien Grondel, Ahmed Mzerd, Anne-Christine Hladky

Crosstalk is an undesirable phenomenon having a negative impact on the electroacoustic performance of ultrasonic transducer arrays, utilized in medical imaging and NDT applications. Indeed, when one element of a transducer array is excited, it generates parasitic voltages and/or displacement fields…

4th International Conference on Electrical and Information Technologies, ICEIT 2020, Mar 2020, Rabat, Morocco. pp.1-6, ⟨10.1109/ICEIT48248.2020.9113231⟩. ⟨hal-03209107⟩

• Article dans une revue

Ферромагнетизм в гетероструктуре ферромагнитная пленка железо-иттриевого граната/ферромагнитный интерметаллид

Т.А. Shaikhulov, T. A, G. A. Ovsyannikov, K. Y. Constantinian, А.А. Klimov, V.V. В Demidov, K. L. Stankevich, Nicolas Tiercelin, Philippe Pernod, S.А. Nikitov

Fizika Tverdogo Tela, 2020, 62 (9), pp.1488. ⟨10.21883/FTT.2020.09.49774.08H⟩. ⟨hal-02963628⟩

• Communication dans un congrès

Short-term reliability of high performance Q-band AlN/GaN HEMTs

R. Kabouche, K. Harrouche, Etienne Okada, F Medjdoub

We report on an on-wafer short-term 40 GHz RF reliability stress test comparison between a 3 nm versus 4 nm barrier thickness AlN/GaN HEMT technology showing state-ofthe-art power performances in the millimeter wave range. It is found that the barrier thickness in this highly strain heterostructure…

IEEE International Reliability Physics Symposium (IRPS 2020), Apr 2020, Dallas, TX, United States. pp.1-6, ⟨10.1109/IRPS45951.2020.9129322⟩. ⟨hal-03044147⟩

• Communication dans un congrès

On the potentialities of architectured structures for underwater applications

Arthur Terroir, Charles Croënne, Jerome O. Vasseur, Mohamadd Ayad, Rachid Rahouadj, Jean-François Ganghoffer, Anne-Christine Hladky

Due to recent developments in additive manufacturing, architectured metamaterials with specific microstructure are widely studied due to the large range of available designs and corresponding effective properties. In this paper, a periodic structure based on a periodic arrangement designed by F.…

Forum Acusticum, Dec 2020, Lyon, France. pp.1155-1155, ⟨10.48465/fa.2020.0507⟩. ⟨hal-03240274⟩

• Article dans une revue

Historical foundations of physics & applied technology as dynamic frameworks in pre-service STEM

Raffaele Pisano, Philippe Vincent, Kosta Dolenc, Mateja Ploj Virtic

In recent decades, the development of sciences and technologies had a significant impact in society. This impact has been object of analysis from several standpoints, i.e., scientific, communication, historical and anthropological. Consequently, serious changes were required by the society. One of…

Foundations of Science, 2020, 30 p. ⟨10.1007/s10699-020-09662-4⟩. ⟨hal-03321533⟩