Publicaciones

Affichage de 13921 à 13930 sur 16059


  • ART

Safety analysis method of a system exposed to electromagnetic risks

B. Demoulin, R. Kassi, D. Degardin, J. Baudet

La Revue de l'électricité et de l'électronique, 2004, 8, pp.57-63. ⟨hal-00162795⟩

  • ART

Versatile bondpad report process for non-planar compound semiconductor devices

S. Garidel, Jean-Pierre Vilcot, M. Zaknoune, P. Tilmant

Microelectronic Engineering, 2004, 71, pp.358-362. ⟨hal-00162776⟩

  • COMM

Electrical Performance of Single and Coupled Cu Interconnects for the 70 nm Technology

K. El Bouazzati, Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht

This paper deals with propagation delay, rise time and crosstalk for Cu wire of 100 nm width and 2.2 to 1.7 aspect ratio AR ( AR /spl sime/ h/w) in single and coupled configuration. Electrical and electromagnetical characteristics are predicted, with a full wave analysis, for various wire...

SPI: Signal Propagation on Interconnects, May 2004, Heidelberg, Germany. pp.189-191, ⟨10.1109/SPI.2004.1409048⟩. ⟨lirmm-00108848⟩

  • COMM

Variation d'indice et absorption obtenus par effet plasma dans les hétérostructures InGaAsP/InP : mesure à 1,3 et 1,55 µm

Malek Zegaoui, Joseph Harari, V. Magnin, Didier Decoster

10èmes Journées Nationales Microélectronique Optoélectronique, JNMO 2004, Jun 2004, La Grande Motte, France. ⟨hal-00141216⟩

  • ART

EXAFS characterization of the gel leading to a hydrothermal deposition of PZT films

S. Euphrasie, S. Daviero-Minaud, Philippe Pernod

Integrated Ferroelectrics, 2004, 60, pp.117-130. ⟨hal-00140718⟩