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Communication dans un congrès

Multi-level microfabrication method used for the 3D AC electroosmotic micropump optimization

G. Dubourg, A. Treizebre, V. Senez

39th International Conference on Micro and Nano Engineering, MNE 2013, 2013, London, United Kingdom. ⟨hal-00878893⟩

Communication dans un congrès

Stress and temperature dependent properties of single crystal piezoelectric materials and devices

R. Meyer, D. Markley, Z. Lowe, N. Sherlock, P. Mosbah

3rd Joint IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2013, Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials Workshop, PFM 2013, 2013, Prague, Czech Republic. ⟨hal-00955676⟩

Communication dans un congrès

A 3.8 GHz tunable filter based on ferroelectric interdigitated capacitors

Areski Ghalem, Freddy Ponchel, Denis Remiens, Tuami Lasri

In this paper, a tunable filter using ferroelectric capacitor is described. The interdigitated capacitor (IDC) is based on Barium Strontium Titanate (BST) thin-film. After the material and capacitor characterization in microwave frequency domain, the IDC has been introduced in a hairpin filter. The...

3rd Joint IEEE International Symposium on the Applications of Ferroelectrics, ISAF 2013, Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials Workshop, PFM 2013, 2013, Prague, Czech Republic. paper ISAF4-M3-3, 252-256, ⟨10.1109/ISAF.2013.6748746⟩. ⟨hal-00955674⟩

Communication dans un congrès

200 GHz communication system using unipolar InAs THz rectifiers

Guillaume Ducournau, A. Westlund, P. Sangare, Christophe Gaquière, P.A. Nislon, L. Desplanque, J.L. Codron, X. Wallart, I. Iniguez de La Torre, J.F. Millithaler, T. Gonzales, J. Mateos, J. Grahn

38th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2013, 2013, Mainz, Germany. paper MO11-3, 2 p., ⟨10.1109/IRMMW-THz.2013.6665492⟩. ⟨hal-00914236⟩

Communication dans un congrès

Wetting performance on patterned substrates : experimental and numerical study

X.M. Xu, G. Vereecke, G. Pourtois, S. Armini, C. Chen, N. Verellen, T. Delande, G. Doumen, F. Kentie, X.P. Shi, I. Simms, K. Nafus, K. Tsai, E. van den Hogen, H. Yang, S. Suhard, Y.K. Siew, V. Moshchalkov, J. Indekeu, Bertrand Nongaillard, Julien Carlier, Pierre Campistron, V. Thomy, F. Holsteyns, H. Struyf, S. de Gendt

Partners Technical Week, 2013, Leuven, Belgium. ⟨hal-00823436⟩