Publicaciones

• Article dans une revue

On the formation of envelope solitons with tube ended by spherical beads

M. de Billy, Anne-Christine Hladky

Ultrasonics, 2012, 52, pp.851-860. ⟨10.1016/j.ultras.2012.01.015⟩. ⟨hal-00786886⟩

• Article dans une revue

Properties of InxGa1-xN films in terahertz range

A. Gauthier-Brun, J.H. Teng, El Hadj Dogheche, W. Liu, A. Gokarna, M. Tonouchi, S.J. Chua, Didier Decoster

Applied Physics Letters, 2012, 100, pp.071913-1-5. ⟨10.1063/1.3684836⟩. ⟨hal-00787430⟩

• Article dans une revue

Searching for THz Gunn oscillations in GaN planar nanodiodes

Ana Iniguez-De-La-Torre, Ignacio Íñiguez-De-La-Torre, Javier Mateos, Tomás González, Paul Sangare, Marc Faucher, Bertrand Grimbert, Virginie Brandli, Guillaume Ducournau, Christophe Gaquière

A detailed study of GaN-based planar asymmetric nanodiodes, promising devices for the fabrication of room temperature THz Gunn oscillators, is reported. By using Monte Carlo simulations, an analysis of the static I-V curves and the time-domain evolution of the current obtained when varying some...

Journal of Applied Physics, 2012, 111 (11), pp.113705. ⟨10.1063/1.4724350⟩. ⟨hal-00788170⟩

• Article dans une revue

Ultrasound tests in a stirred vessel to evaluate the reconstitution ability of dairy powders

B. Richard, Malika Toubal, J.F. Le Page, Georges Nassar, Edouard Radziszewski, Bertrand Nongaillard, P. Debreyne, P. Schuck, Romain Jeantet, Guillaume Delaplace

This study demonstrated the feasibility of applying an ultrasound test to evaluate the ability of a powder to interact with a solvent and thus to predict the reconstitution behaviour of powders. The ultrasound attenuation was monitored and a corresponding relaxation time was calculated. Analysis of...

Innovative Food Science & Emerging Technologies / Innovative Food Science and Emerging Technologies , 2012, 16, pp.233-242. ⟨10.1016/j.ifset.2012.06.007⟩. ⟨hal-00790367⟩

• Article dans une revue

Non-contact thickness gauging of a thin film using surface waves and a void effect on their propagation

Sabrina Fourez, Frédéric Jenot, Mohammadi Ouaftouh, Marc Duquennoy, Mohamed Ourak

Measurement Science and Technology, 2012, 23, pp.085608-1-8. ⟨10.1088/0957-0233/23/8/085608⟩. ⟨hal-00790376⟩

• Article dans une revue

Automatic radar target recognition of objects falling on railway tracks

A. Mroue, M. Heddebaut, F. Elbahhar, Atika Rivenq, Jean-Michel Rouvaen

Measurement Science and Technology, 2012, 23, pp.025401-1-10. ⟨10.1088/0957-0233/23/2/025401⟩. ⟨hal-00788180⟩

• Communication dans un congrès

Production d'espèces par un plasma N2-xO2 et réactivité pour le dépôt de couches minces organosiliciées : étude en spectrométrie de masse

Adriana Annusova, Corinne Foissac, Pavel Veis, Philippe Supiot

Journée Jeunes Chercheurs de l'Union de Génie des Procédés et de l'Energétique du Nord-Pas-de-Calais, UGéPE 2012, 2012, Roubaix, France. ⟨hal-00798836⟩

• Communication dans un congrès

Transistors à effet de champ organiques à base de monomères et oligomères synthétisés par voie de métathèse

E. Parbaile, N. Bejenaru, K. Lmimouni, D. Vuillaume, R. Gauvin, A. Mortreux, N. Cheval, P. Pale

5ème Congrès National sur les Dispositifs Electroniques Organiques, DIELOR 2012, 2012, Limoges, France. ⟨hal-00797705⟩

• Article dans une revue

Non-radiative complete surface acoustic wave bandgap for finite-depth holey phononic crystal in lithium niobate

Didit Yudistira, Yan Pennec, Bahram Djafari-Rouhani, Samuel Dupont, Vincent Laude

We demonstrate the existence of non-radiative complete surface acoustic wave(SAW)bandgaps for two-dimensional piezoelectric phononic crystals of holes. Holes of finite depth in a semi-infinite LiNbO3 substrate are specifically considered. SAWbandgaps are determined from the band structure...

Applied Physics Letters, 2012, 100, pp.061912. ⟨10.1063/1.3684839⟩. ⟨hal-00759306⟩

• Article dans une revue

Wafer level packaging compatible with millimeter-wave antenna

Etienne Herth, Seonho Seok, Nathalie Rolland, T. Lasri

his paper presents a technological process compatible process compatible with an above integrated circuit (IC) to achieve a millimeter wave antenna structure that is well-suited for wafer level packaging technology. The radiating patch is introduced inside of the air cavity of packaging. This...

Sensors and Actuators A: Physical , 2012, 173, pp.238-243. ⟨10.1016/j.sna.2011.09.040⟩. ⟨hal-00788267⟩