Publications

Affichage de 10811 à 10820 sur 16055

COMM

Scalability in a dynamic discovery service-based Jini for the next generation vehicle network

T. Lahdhiri, R. Baroody, N. Al-Holou, Iyad Dayoub, U. Mohammad

IEEE Symposium on Computers and Communications, ISCC'09, 2009, Tunisia. pp.30-35, ⟨10.1109/ISCC.2009.5202398⟩. ⟨hal-00474155⟩

COMM

An Ontology-Based Spatial Clustering Selection System

Wei Gu, Xin Wang, Danielle Ziébelin

Canadian Conference on AI, 2009, Kelowna, Canada. pp.215-218, ⟨10.1007/978-3-642-01818-3_27⟩. ⟨hal-00953205⟩

COMM

Analog, RF and nonlinear behaviors of submicron graded channel partially depleted SOI MOSFETs

M. Emam, M.A. Pavanello, Francois Danneville, D. Vanhoenacker-Janvier, J.P. Raskin

39th European Solid-State Device Research Conference, ESSDERC 2009, 2009, Greece. pp.125-128, ⟨10.1109/ESSDERC.2009.5331397⟩. ⟨hal-00474099⟩

COMM

Low amplitude impulsive noise in vehicular power line network

F. Rouissi, Virginie Degardin, M. Lienard, Pierre Degauque

9th International Conference on Intellingent Transport Systems Telecommunications, 2009, France. pp.538-542, ⟨10.1109/ITST.2009.5399297⟩. ⟨hal-00474516⟩

COMM

Experimental VBLAST-MIMO and SIMO signal processing in a tunnel

C.S. Borras, J.M. Molina-Garcia-Pardo, L. Juan-Llacer, M. Lienard, J.V. Rodrigue

3rd European Conference on Antennas and Propagation, EuCAP 2009, 2009, Berlin, Germany. pp.1748-1752. ⟨hal-00474515⟩

COMM

Comparison between picosecond ultrasonics and nanoindentation characterization in thin film

P.A. Mante, Arnaud Devos, G. Raymond, Pascal Morin, P. Ancey

2009 IEEE International Ultrasonics Symposium, 2009, Italy. pp.2564-2567, ⟨10.1109/ULTSYM.2009.5441964⟩. ⟨hal-00474457⟩

COMM

V-Band Amplifier MMICs Using Multi-Finger InP/GaAsSb DHBT Technology

J. Godin, V. Nodjiadjim, M. Riet, P. Berdaguer, S. Piotrowicz, O. Jardel, A. Scavennec, Jean-Christophe Nallatamby, Christophe Gaquière, M. Werquin

We report on the development of a multi-finger InP/GaAsSb DHBT technology, optimized for the fabrication of RF MMICs. Geometry (number of fingers) and structure optimization has allowed to get FT~200 GHz and FMAX>300 GHz, to suit microwave applications. Special attention has been paid to…

31st IEEE Compound Semiconductor Integrated Circuit Symposium, CSISC 2009, Oct 2009, Greensboro - Caroline du Nord, United States. pp.1-4, ⟨10.1109/csics.2009.5315658⟩. ⟨hal-00474497⟩