Publications

• COMM

How do surfaces control the electrostatics of semiconductor nanostructures ?

Christophe Delerue, Yann Michel Niquet

Materials Research Society Spring Meeting, MRS Spring 2013, Symposium Q : Surfaces of Nanoscale Semiconductors, Apr 2013, San Francisco, United States. ⟨hal-03317242⟩

• COMM

Dual frequency tunable laser system for a microwave and terahertz oscillator

Gwennaël Danion, Goulc'Hen Loas, Ludovic Frein, Cyril Hamel, Anthony Carré, Steve Bouhier, Marc Vallet, Marc Brunel, Antoine Rolland, Mehdi Alouini, François Bondu, Alain Brillet, Jean-Pierre Coulon, Frédéric Cleva, Mourad Merzougui, Alexandre Beck, Guillaume Ducournau, Jean-Francois Lampin, Guillaume Pillet, Mohammed Zaknoune, Christophe Coinon, X. Wallart, Emilien Peytavit, Loïc Morvan, Ghaya Baili, Jérôme Bourderionnet

7th terahertz days, Mar 2013, Cargèse, France. ⟨hal-00906170⟩

• COMM

Sheet resistance of multi-layer stacking of silicene

Pierre Capiod, Maxime Berthe, Andrea Resta, Paola de Padova, Patrick Vogt, Guy Le Lay, Jean-Philippe Nys, B. Grandidier

16ème Forum des Microscopies à Sondes Locales, Mar 2013, Spa, Belgium. ⟨hal-00956275⟩

• COMM

Ionisation par impact dans les jonctions p-n de silicium

Corentin Durand, Pierre Capiod, Maxime Berthe, Jean-Philippe Nys, B. Grandidier

16ème Forum des Microscopies à Sondes Locales, Mar 2013, Spa, Belgique. ⟨hal-00956271⟩

• COMM

THz detection using InP-HEMT and slot-ring antenna

Philippe Artillan, Yannick Roelens, S. Bollaert

7th THz days Groupement de Recherche international (GDRi-THz’13), Mar 2013, Cargèse, France. ⟨hal-04712892⟩

• ART

A 60 GHz Class F-E Power Amplifier for WPAN applications in a 65nm CMOS technology

Nathalie Deltimple, Sophie Drean, Eric Kerherve, Baudouin Martineau, Didier Belot

This work presents a two-stage 60 GHz Power Amplifier designed in a 65nm CMOS technology dedicated to low cost Wireless Personal Area Network (WPAN) applications. In order to provide a high efficiency operation, the PA is based on a Class E power stage. A Class F driver stage is also designed to…

Journal of Integrated Circuits and Systems, 2013, 8 (1), pp.7-13. ⟨hal-00980280⟩

• COMM

[Invited] Extraordinary transmission corrugated antennas at THz

Miguel Beruete, Tahsin Akalin, Unai Beaskoetxea, Miguel Navarro-Cia, Israel Arnedo, Mario Sorolla

4th International Conference on Metamaterials, Photonic Crystals and Plasmonics, META'13, Mar 2013, Sharjah, United Arab Emirates. ⟨hal-00811841⟩

• POSTER

«Nanostructures piézoélectriques fabriquées par faisceau d’ions Ga+ focalisés sur couches minces»

R. Desfeux, A. Ferri, A. da Costa, S. Saitzek, M-H. Chambrier, G. Declercq, A. Bayart, C. Legrand, Z. Shao, Denis Remiens, J. Costecalde, Caroline Soyer, M. Detalle, S. Quignon, Y. Sama, D. Deresmes, David Troadec

Journée d’échange Fédération Chevreul-IEMN –, Mar 2013, Villeneuve d’Ascq, France. 2013. ⟨hal-01739836⟩

• THESE

Modélisation de la propagation et de la réception des ondes élastiques émises par un défaut sous contrainte. Application à la simulation des contrôles non destructifs par émission acoustique, Modeling of the propagation and reception of elastic waves emitted by a crack under stress. Application to the simulation of non-destructive testing by Acoustic Emission

Warida Ben Khalifa

Le contrôle non destructif (CND) par émission acoustique (EA) est utilisé dans un grand nombre de domaines tels l’énergie nucléaire, le secteur pétrolier et gazier, le génie civil ou l’industrie mécanique afin de vérifier l’intégrité des structures sous contrainte. Selon le rapport entre la…, AE Non-destructive testing is used in many fields such as nuclear energy, oil and gas, civil engineering or mechanical engineering to check the integrity of structures under stress. Depending on the ratio of structure thickness to wavelength, the energy released by a crack under stress can…

Autre. Université de Valenciennes et du Hainaut-Cambresis, 2013. Français. ⟨NNT : 2013VALE0007⟩. ⟨tel-00860353⟩

• ART

Hierarchical sizing and biasing of analog firm intellectual properties

Ramy Iskander, Marie-Minerve Louërat, Andreas Kaiser

Integration, the VLSI Journal, 2013, 46 (2), pp.172-188. ⟨10.1016/j.vlsi.2012.01.001⟩. ⟨hal-00795972⟩