Publications

Affichage de 7931 à 7940 sur 16279


  • Communication dans un congrès

Benefits and validation of 4-dummies de-embedding method for characterization of SiGe HBT in G-band

M. Deng, Sylvie Lepilliet, Francois Danneville, Gilles Dambrine, D. Gloria, N. Derrier, P. Chevalier

By taking into account the transistor parasitic lumped elements originated from the contact pads and the metal interconnections including the top-down connection, an enhanced de-embedding procedure for on-wafer G-band measurements has been developed and implemented. This method relies on a…

8th European Microwave Integrated Circuits Conference, EuMIC 2013, and 43rd European Microwave Conference, EuMC 2013, European Microwave Week 2013, 2013, Nuremberg, Germany. paper EuMC/EuMIC04-1, 388-391. ⟨hal-00922492⟩

  • Communication dans un congrès

Comparison of approaches for summative and diagnostic prediction of speech quality

S. Möller, N. Côté, T. Mannoury, M. Wältermann

40th Italian Annual Conference on Acoustics and 39th German Annual Conference on Acoustics, AIA-DAGA 2013, 2013, Merano, Italy. pp.428-431. ⟨hal-00877720⟩

  • Article dans une revue

Low temperature deposition of high performance lead strontium titanate thin films by in situ RF magnetron sputtering

K. Li, X.L. Dong, Denis Remiens, X.Y. Lei, T. Li, G. Du, G.S. Wang

Journal of the American Ceramic Society, 2013, 96, pp.1682-1684. ⟨10.1111/jace.12198⟩. ⟨hal-00877654⟩

  • Communication dans un congrès

Innovative MEMS-MMIC components for agile antenna frontends

L. Baggen, W. Simon, M. Arias Campo, R. Malmqvist, T. Vaha-Heikkila, B. Grandchamp, P. Rolland

7th European Conference on Antennas and Propagation, EuCAP 2013, 2013, Gothenburg, Sweden. pp.1572-1575. ⟨hal-00877746⟩

  • Communication dans un congrès

Optical high frequency test structure and test bench definition for on wafer silicon integrated noise source characterization up to 110 GHz based on germanium-on-silicon photodiode

S. Oeuvrard, Jean-Francois Lampin, Guillaume Ducournau, L. Virot, J.M. Fedeli, J.M. Hartmann, Francois Danneville, Y. Morandini, D. Gloria

26th IEEE International Conference on Microelectronic Test Structures, ICMTS 2013, 2013, Osaka, Japan. pp.73-76, ⟨10.1109/ICMTS.2013.6528148⟩. ⟨hal-00877721⟩

  • Communication dans un congrès

Biomechanical measurement of DNA degradation under therapeutic radiation beams by silicon nanotweezers and associated fluidic cavity

G. Perret, T. Lacornerie, M. Kumemura, N. Lafitte, H. Guillou, L. Jalabert, E. Lartigau, T. Fujii, F. Cleri, H. Fujita, D. Collard

7th International Conference on Microtechnologies in Medicine and Biology, MMB 2013, 2013, Marina del Rey, CA, United States. paper T3P.04, 2 p. ⟨hal-00877774⟩

  • Communication dans un congrès

A 283 GHz low power heterodyne receiver with on-chip local oscillator in 65 nm CMOS process

J. Moron Guerra, A. Siligaris, Jean-Francois Lampin, Francois Danneville, P. Vincent

IEEE Radio Frequency Integrated Circuits Symposium, IEEE RFIC 2013, 2013, Seattle, WA, United States. paper RTU1C-3, 301-304, ⟨10.1109/RFIC.2013.6569588⟩. ⟨hal-00877841⟩

  • Communication dans un congrès

Interesting spatial inhomogeneities in n- and p-doped InAs nanowires grown by gold-seeded molecular beam epitaxy

C. Rolland, P. Caroff, X. Wallart, R. Leturcq

20th International Conference on Electronic Properties of Two-Dimensional Systems, EP2DS-20, 16th International Conference on Modulated Semiconductor Structures, MSS-16, 2013, Wroclaw, Poland. ⟨hal-00878879⟩

  • Communication dans un congrès

Ultimate integration of a PDMS-based lab-on-a-chip with nanotransistor biosensors

R. Sivakumarasamy, K. Nishiguchi, A. Fujiwara, D. Vuillaume, N. Clement

26th International Microprocesses and Nanotechnology Conference, MNC 2013, 2013, Royton Sapporo, Hokkaido, Japan. ⟨hal-00878798⟩