Publications

• Article dans une revue

Broadband dielectric characterization of sapphire/TiOx/Ba0.3Sr0.7TiO3 (111)-oriented thin films for the realization of a tunable interdigitated capacitor

A. Ghalem, Freddy Ponchel, Denis Remiens, Jean-François Legier, T. Lasri

IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2013, 60, pp.880-887. ⟨10.1109/TUFFC.2013.2645⟩. ⟨hal-00821236⟩

• Communication dans un congrès

Magnetoresistive structures and magnetic tunnel junctions with magnetoelastic materials on ferroelectric relaxors for magnetoelectric memories

Nicolas Tiercelin, Yannick Dusch, M. Zaknoune, Y. Deblock, A. Stolz, S. Giordano, Vladimir Preobrazhensky, Philippe Pernod

International French-US Workshop : Toward Low Power Spintronic Devices, 2013, La Jolla, CA, United States. ⟨hal-00903353⟩

• Article dans une revue

Reducing crosstalk in array structures by controlling the excitation voltage of individual elements : a feasibility study

Abdelmajid Bybi, Sébastien Grondel, Jamal Assaad, Anne-Christine Hladky, Christian Granger, Mohamed Rguiti

This paper describes a procedure to minimize crosstalk between the individual elements of a piezoelectric transducer array. A two-dimensional finite elements model was developed and the excitation voltages predicted by the model were applied to the array prototypes made of PZT 27 ceramic. Symmetric…

Ultrasonics, 2013, 53 (6), pp.1135-1140. ⟨10.1016/j.ultras.2013.02.009⟩. ⟨hal-00823966⟩

• Communication dans un congrès

[Invité] Micro et nanotexturation de surfaces : propriétés et applications

V. Senez

7èmes Journées Scientifiques, Biofouling and Antifouling, 2013, Toulon, France. ⟨hal-00823456⟩

• Communication dans un congrès

Acoustic metamaterial plate with negative effective mass density

M. Oudich, Yan Pennec, Bahram Djafari-Rouhani, B. Assouar, Bernard Bonello

IEEE International Ultrasonics Symposium, IUS 2013, 2013, Prague, Czech Republic. ⟨hal-00944046⟩

• Chapitre d'ouvrage

An interferometric diagnostic for the experimental study of dynamics of solids exposed to intense and ultrashort radiation

C. Fourment, F. Deneuville, B. Chimier, D. Descamps, F. Dorchies, S. Hulin, S. Petit, O. Peyrusse, J. J. Santos

no abstract

Juha, L. and Bajt, S. and London, R. and Hudec, R. and Pina, L. Damage to Vuv, Euv, and X-Ray Optics Iv; and Euv and X-Ray Optics: Synergy between Laboratory and Space Iii, 8777, 2013, Proceedings of SPIE. ⟨hal-01561847⟩

• Article dans une revue

Hybrid polyaniline/nanomagnetic particles composites : high performance materials for EMI shielding

N. El Kamchi, B. Belaabed, J.L. Wojkiewicz, S. Lamouri, T. Lasri

In this work, two types of hybrid composite materials were elaborated. The first based on polyaniline (PANI) doped Camphor Sulfonic acid (CSA), Carbon-Coated Cobalt (CCo), and FeNi nanoparticles dispersed in polyurethane. A value of 104 S/m of conductivity and a 90 dB of shielding effectiveness in…

Journal of Applied Polymer Science, 2013, 127, pp.4426-4432. ⟨10.1002/app.38036⟩. ⟨hal-00796448⟩

• Article dans une revue

Characteristics of highly (001) oriented (K,Na)NbO3 films grown on LaNiO3 bottom electrodes by RF magnetron sputtering

T. Li, G.S. Wang, Denis Remiens, X.L. Dong

Ceramics International, 2013, 39, pp.1359-1363. ⟨10.1016/j.ceramint.2012.07.074⟩. ⟨hal-00796459⟩

• Article dans une revue

Inter- and intragranular plasticity mechanisms in ultrafine-grained Al thin films : an in situ TEM study

Frédéric Mompiou, Marc Legros, A. Boé, M. Coulombier, J.P. Raskin, T. Pardoen

Acta Materialia, 2013, 61, pp.205-216. ⟨10.1016/j.actamat.2012.09.051⟩. ⟨hal-00795948⟩

• Article dans une revue

W-band RF-MEMS Dicke switch networks in a GaAs MMIC process

S. Bint Reyaz, C. Samuelsson, R. Malmqvist, S. Seok, M. Fryziel, P.A. Rolland, B. Grandchamp, P. Rantakari, T. Vähä-Heikkilä

A novel design of a W-band RF-microelectro-mechanical-system (RF-MEMS) Dicke switch network realized in a GaAs monolithic microwave integrated circuit process is presented in this article (including a BenzoCycloButene cap type of 0-level package used as protection during wafer dicing). Such…

Microwave and Optical Technology Letters, 2013, 55, pp.2849-2853. ⟨10.1002/mop.27983⟩. ⟨hal-00871901⟩