Publications

• Communication dans un congrès

Raman spectroscopy characterization of single Si-nanowires

M. Marczak, C. Jastrzebski, W. Gebricki, M. Zdrojek, Thierry Melin, D. Hourlier

6th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2006, 2006, Cranfield, United Kingdom. ⟨hal-00243977⟩

• Communication dans un congrès

Sub-picosecond time-domain measurement of heterojunction bipolar transistors and photodiodes

Alexandre Beck, Jean-Francois Lampin, Mohammed Zaknoune, L. Desplanque, Francis Mollot

We demonstrate the time-domain measurement of the dynamic response of heterojunction bipolar transistors (HBT) and uni-travelling carrier photodiodes (UTC-PD) with sub-picosecond resolution. For the HBT, the stimulus is a step applied to the base. For the UTC-PD, we use optical excitation with 150…

Joint 31st International Conference on Infrared and Millimeter Waves and 14th International Conference on Terahertz Electronics, IRMMW-THz2006, Sep 2006, Shanghai, China. pp.510, ⟨10.1109/ICIMW.2006.368718⟩. ⟨hal-00243970⟩

• Communication dans un congrès

Digital solution for inter-vehicle localisation system by means of Direction-Of-Arrival

V.Y. Vu, A. Benlarbi-Delaï

International Symposium on Intelligent Signal Processing and Communication Systems, ISPACS 2006, 2006, Japan. pp.875-878, ⟨10.1109/ISPACS.2006.364781⟩. ⟨hal-00241356⟩

• Communication dans un congrès

Analyse d'une multicouche magnétostrictive TbCo2/Fe par sonde atomique tomographique assistée par laser

A. Grenier, E. Cadel, F. Vurpillot, R. Larde, Nicolas Tiercelin, J. Juraszek, J. Teillet

10èmes Journées de la Matière Condensée, JMC10, 2006, Toulouse, France. ⟨hal-00241168⟩

• Communication dans un congrès

Second harmonic generation through a plate immersed in water : theory and experiment

L. Haumesser, F. Vander Meulen, Pierre Maréchal, Olivier Bou Matar

IEEE International Ultrasonics Symposium, 2006, Vancouver, Canada. pp.1782-1785, ⟨10.1109/ULTSYM.2006.448⟩. ⟨hal-00241165⟩

• Communication dans un congrès

Blind channel equalization in down-link MC-CDMA systems exploiting guard interval redundancy and excess codes

D.A. Bouzidi, K. Abed-Meriam, A. Djebbari, Jean-Michel Rouvaen

7th IEEE International Workshop on Signal Processing Advances in Wireless Communications, SPAWC 2006, 2006, France. pp.557-561, ⟨10.1109/SPAWC.2006.346420⟩. ⟨hal-00247414⟩

• Article dans une revue

TEM study of iridium silicide contact layers for low Schottky barrier MOSFETs

A. Laszcz, A. Czerwinski, J. Ratajczak, J. Katcki, N. Breil, G. Larrieu, Emmanuel Dubois

An influence of annealing temperatures (300, 400 and 500°C) on the iridium silicide formation in the Ir/Si structure was analysed by means of the transmission electron microscopy (TEM). The silicide layer is formed by the solid-state reaction b etween 15 nm thick Ir metallisation and a Si layer…

Archives of Metallurgy and Materials, 2006, 51 (4), pp.551-554. ⟨hal-00152968⟩

• Communication dans un congrès

Design, analysis and fabrication of high frequency piezoelectric transducers

Anne-Christine Hladky, J.C. Debus, Bertrand Dubus, F. Duval, C. Granger, P. Mosbah, Jamal Assaad, Sébastien Grondel, Eric Cattan, E.E. Newnham

Polecer International Conference, Piezoceramics for end-users II, 2006, Lillehammer, Norway. ⟨hal-00126491⟩

• Article dans une revue

Strain determination in MBE-grown InAs quantum wires on InP

A. Mazuelas, L. Gonzalez, J. M. Garcia, Y. Gonzalez, T. Schuelli, C. Priester, H. T. Metzger

Physical Review B: Condensed Matter and Materials Physics (1998-2015), 2006, 73, pp.045312-1-6. ⟨hal-00127060⟩

• Communication dans un congrès

Victim and Aggressor Line Electrical Modelisation in an Multicoupled Interconnect Environment for Transient Simulation

Freddy Ponchel, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht

An electrical modelisation of eight lossy Cu interconnects is proposed thanks to the implementation of a vector finite element method. This full wave analysis gives frequency dependence of proper or mutual inductance, capacitance or resistance from resulting transmission line equations system.…

SPI: Signal Propagation on Interconnects, May 2006, Berlin, Germany. pp.249-251, ⟨10.1109/SPI.2006.289235⟩. ⟨lirmm-00102776⟩