Publications

Affichage de 12881 à 12890 sur 16261


  • Communication dans un congrès

On the efficiency of several active materials used for vibration damping

Anne-Christine Hladky, C. Granger, M. Phamthi

2006, pp.1128-1131. ⟨hal-00147505⟩

  • Communication dans un congrès

Design of branch-line coupler in the G-frequency band

Gaëtan Prigent, Eric Rius, Karine Blary, Henri Happy, Sylvie Lepilliet

This paper deals with the design of broadband hybrid coupler in thin film microstrip (TFMS) technology for millimeter-wave applications in the G-band frequency range. The couplers to be designed are realized in BCB-based (benzo-cyclo-butene) technology. Classical 3-dB branch-line coupler is…

European Microwave Conference, Sep 2006, Manchester, United Kingdom. pp.1296-1299, ⟨10.1109/EUMC.2006.281234⟩. ⟨hal-00147508⟩

  • Communication dans un congrès

Fabrication of 1mm3 size zero-level packaging using wafer-level BCB bonding and glass wet-etching technique for devices MEMS

S. Seok, N. Rolland, P.A. Rolland

2006, pp.53-54. ⟨hal-00147518⟩

  • Communication dans un congrès

A co-operative radar system for collision avoidance and communications between vehicles

C. Tatkeu, P. Deloof, Yassin El Hillali, Atika Rivenq, Jean-Michel Rouvaen

2006, pp.1012-1016. ⟨hal-00147738⟩

  • Article dans une revue

A Bi-stable Micro-machined Piezoelectric Transducer for Mechanical to Electrical Energy Transformation

Karim Dogheche, B. Cavallier, P. Delobelle, L. Hirsinger, Eric Cattan, Denis Remiens, M. Marzencki, B. Charlot, Skandar Basrour, S. Ballandras

The development of micro-machined ultrasonic transducers on silicon opens new appli-cation fields for Si-based acoustic sensors operating in air or in liquids. In this work, wedescribe the fabrication of piezoelectric micro-machined ultrasonic transducers (pMUT)first dedicated to ultrasonic imaging…

Integrated Ferroelectrics, 2006, 80, pp.305-315. ⟨10.1080/10584580600659878⟩. ⟨hal-00135742⟩

  • Communication dans un congrès

65 nm RFCMOS technologies with bulk and HR SOI substrate for millimeter wave passives and circuits characterized up to 220 GHz

F. Gianesello, D. Gloria, S. Montusclat, C. Raynaud, S. Boret, C. Clement, S. Dambrine, Sylvie Lepilliet, F. Saguin, P. Scheer, P. Benech, J.M. Fournier

2006, 4 pp. ⟨hal-00154919⟩

  • Communication dans un congrès

State of the art 200 GHz passive components and circuits integrated in advanced thin SOI CMOS technology on high resistivity substrate

F. Gianesello, D. Gloria, C. Raynaud, S. Montusclat, S. Boret, C. Clement, P. Benech, J.M. Fournier, Gilles Dambrine

2006, pp.121-122. ⟨hal-00154918⟩

  • Communication dans un congrès

Multihop wireless communications with non regenerative relays

A. Bendjaballah, H. El Ghannudi, Laurent Clavier, N. Rolland, P.A. Rolland

2006, 4 pp. ⟨hal-00152956⟩

  • Communication dans un congrès

HF characterization of CNTFET

Henri Happy, Jean-Marc Bethoux, Alexandre Siligaris, Gilles Dambrine, Jean-Sébastien Borghetti, Vincent Derycke, Jean-Philippe Bourgoin

IEEE Radio and Wireless Symposium, RWS 2006, Workshop 'Nanostructure: RF Characterization, modeling and applications', 2006, San Diego, CA, United States. ⟨hal-00126803⟩