Publications
Affichage de 13691 à 13700 sur 16561
Theoretical and experimental characterization of Y-branch nanojunction rectifier up to 94 GHz
L. Bednarz, R. Rashmi, G. Farhi, B. Hackens, V. Bayot, I. Huynen, J.S. Galloo, Yannick Roelens, S. Bollaert, A. Cappy
2005, 4 pp. ⟨hal-00154895⟩
Metamaterial-based transmission line : the fin line approach
A. Marteau, T. Decoopman, M.F. Foulon, Eric Lheurette, D. Lippens
2005, 4 pp. ⟨hal-00154901⟩
A Bi-stable Micro-machined Piezoelectric Transducer for Mechanical to Electrical Energy Transformation .
Karim Dogheche, B. Cavallier, P. Delobelle, L. Hirsinger, Eric Cattan, Denis Remiens, M. Marzencki, B. Charlot, S. Ballandras, Skandar Basrour
17th International Symposium on Integrated Ferroelectrics (ISIF 2005), Shanghai, China, april 17-20,, 2005, China. ⟨hal-00135677⟩
Close infrared thermography using an intensified CCD camera : application in nondestructive high resolution evaluation of electrothermally actuated MEMS
B. Serio, J.J. Hunsinger, F. Conseil, P. Derderian, D. Collard, L. Buchaillot, M.F. Ravat
2005, pp.819-829. ⟨hal-00147502⟩
Terahertz radiation from heavy-ion-irradiated In0.53Ga0.47As photoconductive antenna excited at 1.55 µm
N. Chimot, J. Mangeney, L. Joulaud, P. Crozat, H. Bernas, K. Blary, Jean-Francois Lampin
Applied Physics Letters, 2005, 87, pp.193510-1-3. ⟨hal-00162806⟩
Optimisation de la correction de biais dans le récepteur PIC multi-étages pour le système CDMA
M. Moussaoui
2005. ⟨hal-00162808⟩
Terahertz emission from nanometric HEMTs analyzed by noise spectra
J.F. Millithaler, L. Varani, C. Palermo, J. Mateos, T. Gonzalez, S. Perez, D. Pardo, W. Knap, J. Lusakowski, N. Dyakonova, S. Bollaert, A. Cappy
Terahertz emission from nanometric HEMTs analyzed by noise spectra, 2005, Salamanca, Spain. pp.335-338, ⟨10.1063/1.2036763⟩. ⟨hal-00154896⟩
High performances of InP channel power HEMT at 94 GHz
F Medjdoub, M. Zaknoune, X. Wallart, Christophe Gaquière, D. Theron
Electronics Letters, 2005, 41, pp.1406-1408. ⟨hal-00154912⟩
Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices
G. Ulliac, S. Garidel, Jean-Pierre Vilcot, P. Tilmant
Microelectronic Engineering, 2005, 81, pp.53-58. ⟨hal-00125664⟩
Nouveaux microcapteurs thermiques en technologie silicium pour des applications en automobile
M. Haffar, M. Ait-Hammouda Yala, K. Ziouche, P. Godts, Didier Leclercq
Galerie de la Recherche et de l'Innovation, 2005, Marcq en Baroeul, France. ⟨hal-00126736⟩