Publications

Affichage de 13941 à 13950 sur 16058


  • ART

Versatile bondpad report process for non-planar compound semiconductor devices

S. Garidel, Jean-Pierre Vilcot, M. Zaknoune, P. Tilmant

Microelectronic Engineering, 2004, 71, pp.358-362. ⟨hal-00162776⟩

  • ART

Safety analysis method of a system exposed to electromagnetic risks

B. Demoulin, R. Kassi, D. Degardin, J. Baudet

La Revue de l'électricité et de l'électronique, 2004, 8, pp.57-63. ⟨hal-00162795⟩

  • COMM

LP-MOCVD growth of GaAlN/GaN heterostructures on silicon carbide. Application to HEMT's devices

Marie-Antoinette Di Forte-Poisson, M. Magis, Maurice Tordjman, Raphaël Aubry, Nicolas Sarazin, M. Peschang, Erwan Morvan, Sylvain Laurent Delage, J. Di Persio, Raymond Quéré, B. Grimbert, Virginie Hoel, E. Delos, Damien Ducatteau, Christophe Gaquière

This paper reports on the LP-MOCVD growth optimisation of GaAlN/GaN heterostructures grown on Silicon Carbide substrates for HEMT applications, and on the first device performances obtained with these structures. The critical impact of some growth parameters on the physical properties of the GaAlN/…

The Twelfth International Conference on Metalorganic Vapor Phase Epitaxy (ICMOVPE-XII), May 2004, Lahina, United States. pp.107-112, ⟨10.1557/PROC-798-Y10.26⟩. ⟨hal-00162796⟩