Publications

Affichage de 2881 à 2890 sur 16289


  • Communication dans un congrès

X-ray microdiffraction study of LiMn1.5 Ni0.5O4 thin films deposited by sputtering for Li-ion micro-batteries application

Clément Leviel, Ankush Bhatia, Maxime Hallot, Florent Blanchard, Jean-Pierre Peireira Ramos, Rita Baddour-Hadjean, Christophe Lethien, Pascal Roussel

Journées 2021 de la Division Chimie du Solide de la SCF, Nov 2021, En ligne, France. 2 p. ⟨hal-03680136⟩

  • Communication dans un congrès

Identification of Sources of Uncertainties in CW Microwave Noncontact Vital Sign Measurement

F. Sekak, F. Boukour, M. Sebbache, M. Haddad, Christophe Loyez, Kamel Haddadi

International Conference on Antenna Measurements and Applications, CAMA 2021, Nov 2021, Antibes Juan-les-Pins, France. pp.614-617, ⟨10.1109/CAMA49227.2021.9703622⟩. ⟨hal-03627132⟩

  • Article dans une revue

Silicon nanowire-hydrogenated TiO2 core-shell arrays for stable electrochemical micro-capacitors

Yasmina Bencheikh, Ahmed Addad, Yannick Coffinier, Umesh Kumar, Pascal Roussel, Sabine Szunerits, Toufik Hadjersi, Mohammed Amin, Seddik El Hak Abaidia, Rabah Boukherroub

In this paper, we fabricated silicon nanowire-TiO2 core-shell arrays in a two-step process. First, silicon nanowire arrays (SiNW) were prepared in HF/AgNO3 aqueous solution using metal-assisted chemical etching of bulk silicon. Then, atomic layer deposition (ALD) technique was applied to coat a 20…

Electrochimica Acta, 2021, 396, pp.139198. ⟨10.1016/j.electacta.2021.139198⟩. ⟨hal-03501760⟩

  • Communication dans un congrès

Fortran Package Manager: Toward a rich ecosystem of Fortran packages

Sebastian Ehlert, Ondřej Čertík, Milan Curcic, Jakub Jelínek, Laurence Kedward, Vincent Magnin, Emanuele Pagone, Brad Richardson, John Urban

Fortran is the oldest programming language still in use today, targeting high-performance scientific and engineering applications. Traditionally, Fortran software has used build systems that are not portable or are difficult to use or extend. This has presented a significant barrier to entry for…

PackagingCon 2021, Nov 2021, Online, United States. ⟨hal-03519886⟩