Publications

Affichage de 3271 à 3280 sur 16263


  • Communication dans un congrès

20 Gbit/s 306 GHz link enabled by Yagi-Uda antenna

Guillaume Ducournau, Fabio Pavanello, Aritrio Bandyopadhyay, Cybelle Belem-Gonçalves, Frédéric Gianesello, Cyril Luxey, Emilien Peytavit, Jean-Francois Lampin, Malek Zegaoui, Mohammed Zaknoune

We report on the use of a Yagi-Uda antenna on polymer substrate used in a 306 GHz-20 Gbit/s real-time data link for indoor applications. The Yagi-Uda antenna is described and the validation of the THz link is obtained in amplitude modulation mode and using QAM-16 signals (32 Gbit/s).

2021 URSI GASS Conference, Session D08: Integrated Terahertz Electronic and Photonic Devices and Systems (Part 2), Aug 2021, Rome, Italy. pp.939-942. ⟨hal-03413356⟩

  • Article dans une revue

Piezoresistance in defect-engineered silicon

Heng Li, Abel Thayil, Chris Lew, Marcel Filoche, Brett Johnson, Jeff Mccallum, S. Arscott, Alistair C. H. Rowe

The steady-state, space-charge-limited piezoresistance (PZR) of defect-engineered, silicon-on-insulator device layers containing silicon divacancy defects changes sign as a function of applied bias. Above a punch-through voltage (Vt) corresponding to the onset of a space-charge-limited hole current…

Physical Review Applied, 2021, 15 (1), 014046, 9 p. ⟨10.1103/PhysRevApplied.15.014046⟩. ⟨hal-03003310⟩

  • Article dans une revue

Mm-wave through-load element for on-wafer measurement applications

Marc Margalef-Rovira, Olivier Occello, Abdelhalim Saadi, Vanessa Avramovic, Sylvie Lepilliet, Loïc Vincent, Manuel J. Barragan, Emmanuel Pistono, Sylvain Bourdel, Christophe Gaquière, Philippe Ferrari

This paper presents an innovative Through-Load element aimed at characterization applications at mm-wave frequencies. The proposed structure can behave as a Through connection or as a 50-Ω load depending on a DC control voltage. Among other potential applications, this system can be used to…

IEEE Transactions on Circuits and Systems I: Regular Papers, 2021, 68 (8), pp.3170-3183. ⟨10.1109/TCSI.2021.3072097⟩. ⟨hal-03202213⟩

  • Autre publication scientifique

Advances in Historical Studies [Editor in Chief 10/3]

Raffaele Pisano

2021. ⟨hal-04510951⟩

  • Communication dans un congrès

Laser-combined scanning tunneling microscopy on low-temperature grown GaAs

Yevheniia Chernukha, Maxime Berthe, Pascale Diener, B. Grandidier

Journées du GDR Nanosciences with near-field microscopy under ultra high vacuum 2021, Nov 2021, Toulouse, France. ⟨hal-03606048⟩

  • Communication dans un congrès

Polydimethylsiloxane micro-channels application for the study of dynamic wetting of nano-etched silicon surfaces based on acoustic characterization method

Abbas Salhab, Julien Carlier, Pierre Campistron, M. Neyens, Malika Toubal, Bertrand Nongaillard, V. Thomy

Efficient cleaning of contaminations in the semiconductor industry is a determining factor in ensuring the good quality of the electronics products. We present here the dynamic wetting characterization of a fluid on top of Deep Trench Isolation (DTI) structures using ultra-high frequency acoustic…

15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Session 6 - Wet processing in narrow spaces and pattern collapse, Apr 2021, Virtual, Unknown Region. pp.143-149, ⟨10.4028/www.scientific.net/SSP.314.143⟩. ⟨hal-03362264⟩

  • Communication dans un congrès

[Invited workshop] Nanorobotic On-Wafer Probe Station Under Scanning Electron Microscope

Kamel Haddadi

15th European Microwave Week - Workshop Measurements at mmWave and Terahertz Frequencies of Three Measurement Quantities: S-Parameters, Power, and Complex Permittivity of Dielectric Materials, Jan 2021, Utrecht, Netherlands. ⟨hal-03582098⟩