Publications

Affichage de 4521 à 4530 sur 16100


  • Communication dans un congrès

Indoor 1-40 GHz channel measurements

Maria-Teresa Martinez-Ingles, Juan Pascual-Garcia, Davy Gaillot, Concepcion Borras, Jose-Maria Molina-Garcia-Pardo

13th European Conference on Antennas and Propagation, EuCAP 2019, Mar 2019, Krakow, Poland. pp.295-299. ⟨hal-03346228⟩

  • Communication dans un congrès

300 GHz wireless communication systems exploiting the benefits of combining photonic and electronic transceiver components

I Kallfass, I Dan, P. Szriftgiser, V Chinni, Mohammed Zaknoune, Guillaume Ducournau

The contribution presents a wireless data transmission experiment combining photonic and electronic technologies. The photonic transmitter is based on the use of unitraveling-carrier (ETC) photodiodes. The electronic receiver is based on multi-functional monolithic integrated circuits realized in…

2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Sep 2019, Paris, France. ⟨10.1109/IRMMW-THz.2019.8874420⟩. ⟨hal-03286181⟩

  • Article dans une revue

3D Patterning of Si by Contact Etching With Nanoporous Metals

Stéphane Bastide, Encarnacion Torralba, Mathieu Halbwax, Sylvain Le Gall, Elias Mpogui, Christine Cachet-Vivier, Vincent Magnin, Joseph Harari, Dmitri Yarekha, Jean-Pierre Vilcot

Nanoporous gold and platinum electrodes are used to pattern n-type silicon by contact etching at the macroscopic scale. This type of electrode has the advantage of forming nanocontacts between silicon, the metal and the electrolyte as in classical metal assisted chemical etching while ensuring…

Frontiers in Chemistry, 2019, 7, pp.256. ⟨10.3389/fchem.2019.00256⟩. ⟨hal-02409484⟩

  • Communication dans un congrès

A method to determine wide bandgap power devices packaging interconnections

Loris Pace, N. Defrance, Jean-Claude de Jaeger, Arnaud Videt, Nadir Idir

Wide Bandgap (WBG) power devices show very good characteristics for high frequency operation in power converters, leading to a better power integration by reducing size and weight of passive components. Access parasitics such as resistances and inductances related to packaging and interconnections…

23rd IEEE Workshop on Signal and Power Integrity (SPI), Jun 2019, Chambery, France. pp.1-4, ⟨10.1109/SaPIW.2019.8781641⟩. ⟨hal-03276911⟩

  • N°spécial de revue/special issue

History of Machines and Mechanisms [Special Issue]

Marco Ceccarelli, Raffaele Pisano

Advances in Historical Studies, 8 (1), 2019. ⟨hal-04511002⟩

  • Autre publication scientifique

Advances in Historical Studies [Editor in Chief 8/2]

Raffaele Pisano

2019. ⟨hal-04510996⟩