Publications

Affichage de 5541 à 5550 sur 16180


  • Article dans une revue

Theoretical and experimental study of a thermal damper based on a CNT/PCM composite structure for transient electronic cooling

Christophe Kinkelin, Stéphane Lips, Ulrich Soupremanien, Vincent Remondière, Jean Dijon, Hélène Le Poche, Emmanuel Ollier, Malek Zegaoui, Nathalie Rolland, Paul-Alain Rolland, Sandrine Lhostis, Brigitte Descouts, Yann Kaplan, Frédéric Lefèvre

The present study focuses on a thermal damper that aims at smoothing the temperature peaks experienced by electronic components during transient solicitations. It consists of a silicon casing containing a densified or undensified carbon nanotube (CNT) array - linking directly both sides of the…

Energy Conversion and Management, 2017, 142, pp.257-271. ⟨10.1016/j.enconman.2017.03.034⟩. ⟨hal-01494833⟩

  • Article dans une revue

Influence of neutron irradiation on electron traps induced by NGB stress in AlInN/GaN HEMTs

Sébastien Petitdidier, Yannick Guhel, Guillaume Brocero, Philippe Eudeline, Jean-Lionel Trolet, Patrick Mary, Christophe Gaquière, Bertrand Boudart

IEEE Transactions on Nuclear Science, 2017, pp.1 - 1. ⟨10.1109/TNS.2017.2708692⟩. ⟨hal-01645121⟩

  • Article dans une revue

Flexible Nanoholey Patches for Antibiotic-Free Treatments of Skin Infections

Chengnan Li, Ran Ye, Julie Bouckaert, Amaia Zurutuza, Djamel Drider, Tetiana Dumych, Solomiya Paryzhak, Volodymyr Vovk, Rostyslav O. Bilyy, Sorin Melinte, Musen Li, Rabah Boukherroub, Sabine Szunerits

Despite the availability of different antibiotics, bacterial infections are still one of the leading causes of hospitalization and mortality. The clinical failure of antibiotic treatment is due to a general poor antibiotic penetration to bacterial infection sites as well as the development of…

ACS Applied Materials & Interfaces, 2017, 9 (42), pp.36665-36674. ⟨10.1021/acsami.7b12949⟩. ⟨hal-01716582⟩

  • Article dans une revue

3D patterning of silicon by contact etching with anodically biased nanoporous gold electrodes

Encarnación Torralba, Mathieu Halbwax, Taha El Assimi, Marin Fouchier, Vincent Magnin, Joseph Harari, Jean-Pierre Vilcot, Sylvain Le Gall, Raphaël Lachaume, Christine Cachet-Vivier, Stéphane Bastide

A novel strategy to achieve 3D pattern transfer into silicon in a single step without using lithography is presented. Etching is performed electrochemically in HF media by contacting silicon with a positively biased, patterned, metal electrode. Dissolution is localized at the Si/metal contacts and…

Electrochemistry Communications, 2017, 76, pp.79-82. ⟨10.1016/j.elecom.2017.01.014⟩. ⟨hal-01480682⟩