Publications

Affichage de 7521 à 7530 sur 16279


  • Communication dans un congrès

Giant piezoresistance in silicon nanowires

A.C.H. Rowe, J.S. Milne, S. Arscott

Materials Research Society Spring Meeting, MRS Spring 2013, Symposium Q : Surfaces of Nanoscale Semiconductors, 2013, San Francisco, CA, United States. ⟨hal-00811788⟩

  • Communication dans un congrès

Theoretical insights in weakly interacting epitaxial systems

I. Lefebvre, J.J. Wang

Workshop on Functional Oxides for Integration in Micro- and Nano-Electronics, 2013, Autrans, France. ⟨hal-00811811⟩

  • Communication dans un congrès

Ultrahigh sensitive terahertz detection by asymmetric dual-grating gate HEMT structure

Y. Kurita, Guillaume Ducournau, K. Kobayashi, Y. Meziani, V. Popov, Wojciech Knap, T. Otsuji

International Workshop on Terahertz Science and Technology, OTST 2013, 2013, Kyoto, Japan. ⟨hal-00811840⟩

  • Article dans une revue

Theoretical approach to the feasibility of power-line communication in aircrafts

Virginie Degardin, I. Junqua, M. Lienard, Pierre Degauque, S. Bertuol

IEEE Transactions on Vehicular Technology, 2013, 62, pp.1362-1366. ⟨10.1109/TVT.2012.2228245⟩. ⟨hal-00812342⟩

  • Communication dans un congrès

Optimization of AlGaN/GaN high electron mobility heterostructues on silicon for low cost power devices operating at 40 GHz

Stéphanie Rennesson, M. Chmielowska, S. Chenot, Yvon Cordier, François Lecourt, N. Defrance, Marie Lesecq, Virginie Hoel, Etienne Okada, Jean-Claude de Jaeger

10th International Conference on Nitride Semiconductors, ICNS-10, 2013, Washington, DC, United States. ⟨hal-00987956⟩

  • Article dans une revue

Submicrometer InP/InGaAs DHBT Architecture Enhancements Targeting Reliability Improvements

Gilles Amadou Koné, Brice Grandchamp, Cyril Hainaut, François Marc, Nathalie Labat, Thomas Zimmer, Virginie Nodjiadjim, Muriel Riet, Jean-Yves Dupuy, Jean Godin, Cristell Maneux

IEEE Transactions on Electron Devices, 2013, 60 (3), pp.1068-1074. ⟨10.1109/TED.2013.2241067⟩. ⟨hal-00909053⟩

  • Article dans une revue

BCB cap packaging of MEMS switches integrated with 100-m MMIC wafer

S. Seok, J. Kim, M. Fryziel, N. Rolland, B. Grandchamp, W. Simon, R. Baggen

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3, pp.1799-1803. ⟨10.1109/TCPMT.2013.2278713⟩. ⟨hal-00903757⟩

  • Communication dans un congrès

ANL-MEMS : Techniques d'imagerie acoustique non linéaire pour l'étude de la fiabilité des MEMS

Olivier Bou Matar, V. Aleshin, Abdelkrim Talbi, Huan Zhou, Nikolay Chigarev, Vitali Goussev, C. Ni, V. Tournat

Journées Nationales en Nanosciences et Nanotechnologies, J3N 2013, 2013, Marseille, France. ⟨hal-00940897⟩