Publications

• COUV

Metamorphic InAIAs/InGaAs HEMTs : material properties and device performance

Y. Cordier, S. Bollaert, M. Zaknoune, J.M. Chauveau, A. Cappy

CAI W.Z. III-V semiconductor heterostructures : physics and devices, Research Signpost, Kerala, India, pp.111-138, 2003. ⟨hal-00132383⟩

• COMM

Microfluidics for proteomics : continuous liquids

S. Le Gac, C. Rolando, S. Arscott, Julien Carlier, F. Caron, J.C. Fourrier, V. Thomy, C. Druon, P. Tabourier, J.C. Camart

Japan-European Workshop on Chem Micro Mechatronics Systems and Biochips, 2003, Cachan, France. ⟨hal-00146399⟩

• COMM

Phase sensitivity of low frequency ultrasound wave emitted by a nonlinear interaction of phase conjugate acoustic beams

Philippe Pernod, Vladimir Preobrazhensky, Y.U. Pylnov

2003, pp.855-857. ⟨hal-00146131⟩

• COMM

Cymbal flextensional transducers. Biomedical arrays, design and fabrication studies

D. Markley, R. Newnham, R. Meyer, W.J. Hughes, N. Smith, S. Yip Lee, Anne-Christine Hladky

American Ceramic Society 105th Annual Meeting, 2003, Nashville,TN, United States. ⟨hal-00145964⟩

• COMM

Composants balistiques pour applications térahertz

S. Bollaert, Yannick Roelens, Jean-Sebastien Galloo, Isabelle Huynen, Hervé Boutry, Javier Mateos

GDR Nanoélectronique : 1ères Journées Nationales Composants pour la micro et nano-électronique, 4èmes Journées Nationales Hétérostructures de semiconducteurs IV-IV, 2003, Grenoble, France. ⟨hal-00146019⟩

• COMM

Sommation optique de signaux hyperfréquences

N. Breuil, C. Fourdin, P. Nicole, G. Ulliac, Jean-Pierre Vilcot, J. Chazelas

2003, pp.6C-6. ⟨hal-00146559⟩

• COMM

Modélisation d'interconnexions submicroniques VLSI en présences des milieux environnants à pertes

K. El Bouazzati, Jean-François Legier, Erick Paleczny, Christophe Seguinot, Denis Deschacht

IES, 2003, Villeneuve d'Ascq, France. pp.2D-17. ⟨hal-00146561⟩

• ART

Concept of dielectric constant for nanosized systems

Christophe Delerue, Guy Allan, Michel Lannoo

The screening properties of dielectric nanocrystals are analyzed. General arguments confirmed by detailed numerical calculations are presented. It is shown how macroscopic components of the electric field can still be defined for sizes larger than a few Fermi wavelengths and can still be obtained…

Physical Review B: Condensed Matter and Materials Physics (1998-2015), 2003, 68, pp.115411-1-4. ⟨10.1103/PhysRevB.68.115411⟩. ⟨hal-00146590⟩

• COMM

Physics-based process simulation of ultrashallow junctions

N.E.B. Cowern, B. Colombeau, R. Duffy, V. Venezia, C. Dachs, R. Lindsay, Fuccio Cristiano, E. Lampin, Alain Claverie

Ultra-Shallow Junctions Worshop, 2003, Santa Cruz, CA, United States. ⟨hal-00146422⟩

• COMM

Numerical analysis of the process induced stresses in silicon microstructures

V. Senez, T. Hoffmann, A. Armigliato, I. de Wolf

2003, pp.350-361. ⟨hal-00146444⟩