Publications

Affichage de 4241 à 4250 sur 15692


  • Communication dans un congrès

Large-area femtosecond laser ablation of Silicon to create membrane with high performance CMOS-SOI RF functions

Arun Bhaskar, Justine Philippe, Matthieu Berthomé, Etienne Okada, J.F. Robillard, Daniel Gloria, Christophe Gaquière, Emmanuel Dubois

Femtosecond laser processing is a tool of increasing relevance for controlled etching of metals, semiconductors, and dielectrics with minimum collateral damage. We make use of this technique to remove silicon locally from the handler substrate of Silicon-on-Insulator (SOI) dies. By combining laser…

2018 7th Electronic System-Integration Technology Conference (ESTC), Sep 2018, Dresden, Germany. pp.801-806, ⟨10.1109/ESTC.2018.8546407⟩. ⟨hal-02317259⟩

  • Communication dans un congrès

Femtosecond pulsed laser for advanced photonic packaging

Quentin Hivin, Jean-Marc Boucaud, Flavie Braud, Cédric Durand, Frédéric Gianesello, Davide Bucci, J.F. Robillard, Jean-Emmanuel Broquin, Christophe Gaquière, Emmanuel Dubois

The purpose of the advanced applications of glass laser micromachining presented in this paper is to solve the difficulty of both electrical and optical interconnects needed in electro-optical packaging. Glass interposers constitute an innovative approach to integrate different types of…

7th Electronic System-Integration Technology Conference, ESTC 2018, Sep 2018, Dresden, Germany. ⟨10.1109/ESTC.2018.8546374⟩. ⟨hal-01961743⟩

  • Communication dans un congrès

Single mode polymer optical waveguides and out-of-plane coupling structure on a glass substrate

J.M. Boucaud, Q. Hivin, C. Durand, F. Gianesello, Davide Bucci, J.F. Robillard, Francois Vaurette, J.E. Broquin, Emmanuel Dubois

In this paper, we propose an approach to improve silicon photonics-based optical transceivers packaging capabilities thanks to an optical and electrical interposer. We demonstrate the fabrication of polymer optical waveguides, single mode at telecom wavelengths using photosensitive resists and…

7th Electronic System-Integration Technology Conference, ESTC 2018, Sep 2018, Dresden, Germany. ⟨10.1109/ESTC.2018.8546461⟩. ⟨hal-01961666⟩

  • Communication dans un congrès

Towards low-trapping GaN-on-silicon material system for 1200 V applications

Alaleh Tajalli, Idriss Abid, Riad Kabouche, Malek Zegaoui, Matteo Meneghini, Gaudenzio Meneghesso, Enrico Zanoni, A Nishikawa, F Medjdoub

This paper presents an assessment of a GaN-on-silicon buffer structure from the epi-wafer providerALLOS Semiconductors GmbH targeting 1200 V power applications. Epiwafers with 150 mmdiameter were grown by MOCVD on Si (111) substrates. Total GaN thickness is 7.1 µm withseveral interlayers for strain…

European Material Research Society Fall 2018, Sep 2018, Warsaw, Poland. ⟨hal-03287736⟩

  • Communication dans un congrès

Device for light-matter interaction enhancement in the full THz range for precise spectroscopy of small volume samples

Romain Peretti, Sergey I. Mitryukovskiy, Flavie Braud, Emilien Peytavit, Emmanuel Dubois, Jean-Francois Lampin

We designed, fabricated, characterized and performed the first experimental uses of a device assembling a waveguide and two antennas. The goal of our device is to confine the broadband pulse of a time-domain spectroscopy setup in the slot of the waveguide with the minimum losses and dispersion and…

2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2018), Sep 2018, Nagoya, Japan. paper Tu-POS-05, 1-2, ⟨10.1109/IRMMW-THz.2018.8510508⟩. ⟨hal-02317320⟩

  • Communication dans un congrès

From Vesale to Pourcelot via Harvey and Pulsed Color Doppler Ultrasound

Jean-François Moreau, Raffaele Pisano, Jean-Michel Correas

Symposium: Meaningful Colour: Epistemology of Colour in the Sciences, European Society for the History of Science, Sep 2018, London - Royaume Uni, United Kingdom. ⟨hal-04519008⟩

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