Publications
Affichage de 12491 à 12500 sur 16064
Modal bandwidth behaviour under various launch conditions and coupling efficiency of PF GIPOF with fibre connections offsets
A. Goffin, C. Lethien, C. Sion, Christophe Loyez, Jean-Pierre Vilcot
International Conference on Organic Photonics and Electronics 2006 and 9th International Conference on Organic Nonlinear Optics, ICONO 9 - ICOPE 2006, 2006, Brugge, Belgium. ⟨hal-00130886⟩
FENOTIP: microfluidique et nanoélectrode pour la spectroscopie électromagnétique de cellules uniques
Bertrand Bocquet, Vincent Senez, A. Treizebre, Hind Ghandour, Dominique Legrand, Joël Mazurier, Christian Slomianny, Eric Leclercq, Dominique Barthès-Biesel
Journées du Réseau National en Nanosciences et Nanotechnologies, R3N, 2006, Besançon, France. ⟨hal-00130887⟩
High cross-talk InP digital optical switch
Didier Decoster, Malek Zegaoui, Joseph Harari, Jean Chazelas
1st France-Singapore Optical Switching Seminar, 2006, Singapore, Singapore. ⟨hal-00130872⟩
Micro-machined actuators for the friction driven micro-motor
Bernard Legrand, L. Buchaillot, D. Collard
2006, pp.211-214. ⟨hal-00128670⟩
Micro et nanomécanique, MEMS et NEMS
Bernard Legrand, L. Buchaillot, D. Collard
Ecole CNRS : Nanosciences et Nanotechnologies, 2006, Autrans, France. ⟨hal-00128667⟩
Well-Defined Carboxyl-Terminated Alkyl Monolayers Grafted onto H−Si(111): Packing Density from a Combined AFM and Quantitative IR Study
Anne Faucheux, Anne Chantal Gouget-Laemmel, Catherine Henry de Villeneuve, Rabah Boukherroub, François Ozanam, Philippe Allongue, Jean-Noël Chazalviel
Langmuir, 2006, 22 (1), pp.153-162. ⟨10.1021/la052145v⟩. ⟨hal-04166426⟩
Recherche des propriétés d'atténuation électromagnétique de matériaux polymères conducteurs déposés en couches minces
L. Kone, N. Ben Slimen, S. Baranowski, B. Demoulin, J.L. Wojkiewicz, N.N. Hoang
2006, pp.110-112. ⟨hal-00142608⟩
On the efficiency of several active materials used for vibration damping
Anne-Christine Hladky, C. Granger, M. Phamthi
2006, pp.1128-1131. ⟨hal-00147505⟩
Fabrication of 1mm3 size zero-level packaging using wafer-level BCB bonding and glass wet-etching technique for devices MEMS
S. Seok, N. Rolland, P.A. Rolland
2006, pp.53-54. ⟨hal-00147518⟩
Dielectrophoresis, cell culture, and electrical impedance spectroscopy applied to adherent cells in a single biochip
E. Lennon, S. Ostrovidov, V. Senez, T. Fujii
2006, 4 pp. ⟨hal-00147726⟩