Publications

Affichage de 261 à 270 sur 16133


  • Communication dans un congrès

A multiscale approach to investigate the impact of thermal fluctuations on crack propagation in fracture and decohesion

Claudia Binetti, Giuseppe Florio, Nicola M Pugno, Stefano Giordano, Giuseppe Puglisi

In various physical, biological and technological systems, fracture propagation and decohesion phenomena are widespread. Understanding these processes has broad applications, ranging from classical solid mechanics (e.g., crack propagation) to emerging fields such as advanced materials,…

1st HELLENIC-ITALIAN CONFERENCE ON COMPUTATIONAL MECHANICS, BIOMECHANICS AND MECHANICS OF MATERIALS (1st HICOMP), Institute of Structural Analysis and Antiseismic Research, School of Civil Engineering, National Technical University of Athens, Jun 2025, Island of Rhodes, Greece, Greece. ⟨hal-05119211⟩

  • Communication dans un congrès

Electron beam lithography tests on EM Resist’s new 32%-HSQ resist formulation

Yves Deblock, Pascal Tilmant, Anne-Sophie Vaillard, Christophe Boyaval, Saliha Ouendi, Mélanie Brouillard, James Elegbe

2025 Renatech+ Lithography and Etching Days, Jun 2025, Palaiseau, France. ⟨hal-05308260⟩

  • Communication dans un congrès

Réalisation d’une cellule en verre nanostructurée en HSQ. Infiltration par une vapeur de Césium. Application de physique fondamentale

Yves Deblock, Pascal Tilmant, Anne-Sophie Vaillard, Christophe Boyaval, Saliha Ouendi, Mélanie Brouillard, James Elegbe

2025 Renatech+ Lithography and Etching Days, Jun 2025, Palaiseau, France. ⟨hal-05313283⟩

  • Communication dans un congrès

Co-Integration of High-Frequency Devices on Epitaxial ScAlN for Tunable RF SAW Filters

Nagesh Bhat, Seif El Whibi, Edouard Lebouvier, N. Defrance, Jean-Claude de Jaeger, Zahia Bougrioua, Florian Bartoli, Valentina Gallardo-Mödinger, Maxime Hugues, Yvon Cordier, Sami Hage-Ali, Ulrich Youbi, Thierry Aubert, Omar Elmazria, Marie Lesecq

With the rise of 6G and growing data demands, high performance materials for RF components are essential. Scandium-doped aluminum nitride (ScAlN) offers a promising barrier layer for next-generation high electron mobility transistors (HEMTs), providing enhanced carrier density. This piezoelectric…

Wocsdice Exmatec 2025, Jun 2025, Cadiz, Spain. ⟨hal-05467164⟩