Publicaciones

Affichage de 4001 à 4010 sur 5527


  • Communication dans un congrès

Fracture mechanics in new designed power module under thermo‐mechanical loads

Camille Durand, Markus Klingler, Daniel Coutellier, Hakim Naceur, Arian Grams, Olaf Wittler

Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. The reliability is increased by using a copper clip soldered on the top...

JIP 2014 - Fatigue Design & Material Defects, Jun 2014, Paris, France. pp.04015, ⟨10.1051/matecconf/20141204015⟩. ⟨hal-01669938⟩

  • N°spécial de revue/special issue

Advances in Logistics and Transport

Mounir Benaissa, Mourad Abed, Abdellatif Benabdelhafid

International Journal of Business Performance and Supply Chain Modelling, 6, 2014, 1758-9401. ⟨hal-03388749⟩

  • Communication dans un congrès

Sécurité et Conduite automobile

Marie-Pierre Pacaux-Lemoine

Pôle de Recherche sur la Sécurité et la Maîtrise des Risques, Jan 2014, Valenciennes, France. ⟨hal-03432765⟩