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A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

Ahmed Eltawil, Michael Engel, Bibiche Geuskens, Amin Khajeh Djahromi, Fadi Kurdahi, Peter Marwedel, Smail Niar, Mazen Saghir

As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components...

Microprocessors and Microsystems: Embedded Hardware Design , 2013, Embedded Hardware Design, 37 (8), pp.760-771. ⟨10.1016/j.micpro.2013.07.008⟩. ⟨hal-03469465⟩