Publicaciones

Affichage de 3901 à 3910 sur 5566


  • Communication dans un congrès

Failure mechanisms in chip-metallization in power applications

Camille Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

Degradation of the chip-metallization layer in power electronic packages under Active Power Cycling is still a major reliability concern. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop within the package inducing stress and plastic deformation in...

2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Ghent, Belgium. pp.1-5, ⟨10.1109/EuroSimE.2014.6813772⟩. ⟨hal-03474091⟩

  • Article dans une revue

Widgets Dedicated to User Interface Evaluation

Selem Charfi, Abdelwaheb Trabelsi, Houcine Ezzedine, Christophe Kolski

In this article, evaluation-based widgets are proposed as a contribution to assist evaluators for early evaluation of user interfaces. This contribution imbricates the ergonomic quality evaluation process into widgets used for user-interface graphical composition. In other words, these widgets...

International Journal of Human-Computer Interaction, 2014, 30 (5), pp.408-421. ⟨10.1080/10447318.2013.873280⟩. ⟨hal-03280650⟩