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Fracture mechanics in new designed power module under thermo‐mechanical loads

Camille Durand, Markus Klingler, Daniel Coutellier, Hakim Naceur, Arian Grams, Olaf Wittler

Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. The reliability is increased by using a copper clip soldered on the top…

JIP 2014 - Fatigue Design & Material Defects, Jun 2014, Paris, France. pp.04015, ⟨10.1051/matecconf/20141204015⟩. ⟨hal-01669938⟩