Publications

Affichage de 4381 à 4390 sur 5533


  • Communication dans un congrès

Is postural stability of older pedestrians perturbed by the sound of an approaching car ?

Eric Watelain, Janick Naveteur, Aurore Bourrelly, Julie Delzenne, Antonio Pinti, Cyril Garnier, Marie-Agnes Dupuy

Euromov Conference, Jun 2013, Montpellier, France. ⟨hal-03532109⟩

  • Article dans une revue

Enlarging the Domain of Attraction in Nonlinear Polynomial Systems

Faiçal Hamidi, Mohamed Naceur Abdelkrim, Houcem Jerbi, Wahida Aggoune, Mohamed Djemai

This paper addresses the problem of enlarging the Domain of Attraction (DA) based on a Generalized Eigenvalue Problem (GEVP) approach. The main contribution is the maximization of the (DA) while characterizing the asymptotic stability region by a Lyapunov Function. Such result is obtained using a…

International Journal of Computers, Communications and Control, 2013, 8 (4), pp.538-547. ⟨10.15837/ijccc.2013.4.152⟩. ⟨hal-03615604⟩

  • Communication dans un congrès

Protocoles expérimentaux pour la caractérisation de la décohésion dynamique des Composites à Matrice Organique

Vincent Joudon, Gerald Portemont, Franck Lauro, Bruno Bennani

MECADYMAT 2013, Apr 2013, Brest, France. ⟨hal-03513282⟩

  • Article dans une revue

Introduction

Káthia Marçal de Oliveira, Camille Rosenthal-Sabroux

Revue des Sciences et Technologies de l'Information - Série ISI : Ingénierie des Systèmes d'Information, 2013, 18 (3), pp.7-10. ⟨hal-03614642⟩

  • Communication dans un congrès

Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module

Camille Jeanne Margot Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a…

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wrockaw, Poland. ⟨10.1109/EuroSimE.2013.6529900⟩. ⟨hal-03513207⟩