Publications

Affichage de 4401 à 4410 sur 5564


  • Chapitre d'ouvrage

Consideration of the Travel Time Experience in The Conceptual Models Of Personalized Interactive Applications

Arnaud Brossard, Mourad Abed, Christophe Kolski, Guillaume Uster

Book summary : The human-computer interactions are more and more present in our everyday life, and lead to many conceptual and methodological problems for the designers and evaluators of interactive systems.

Christophe Kolski. Human-Computer Interactions in Transport, John Wiley & Sons, Inc, pp.283-310, 2013, 978-1-84821-279-4. ⟨10.1002/9781118601907.ch9⟩. ⟨hal-03405626⟩

  • Communication dans un congrès

Acceptabilité des scanners de sûreté dans les aéroports français

Bako Rajaonah, Jean-Bernard Ravenel, Juan Carlos Castelli, Antoine Osmont, Pierre Cabrol, Gwenn Le Fur

Cet article a pour objectif de présenter les résultats d'une enquête d'opinion menée en collaboration avec la TNS Sofres sur l'acceptabilité des scanners de sûreté qui s'est déroulée en France en juillet 2012. Les principaux résultats indiquent une bonne acceptabilité des…

Workshop Interdisciplinaire sur la Sécurité Globale - WISG2013, Jan 2013, Troyes, France. ⟨hal-01253532⟩

  • Chapitre d'ouvrage

Integrating Human and Organizational Factors into the BCD Risk Analysis Model: An Influence Diagram-based approach

Karima Sedki, Philippe Polet, Frédéric Vanderhaegen

Supervision and Safety of Complex Systems, John Wiley & Sons, Inc., pp.293-316, 2013, 978-184821413-2. ⟨10.1002/9781118561744.ch15⟩. ⟨hal-03624774⟩

  • Communication dans un congrès

Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module

Camille Jeanne Margot Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a…

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wrockaw, Poland. ⟨10.1109/EuroSimE.2013.6529900⟩. ⟨hal-03513207⟩