Publicaciones

Affichage de 3861 à 3870 sur 5525


  • COMM

Failure mechanisms in chip-metallization in power applications

Camille Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

Degradation of the chip-metallization layer in power electronic packages under Active Power Cycling is still a major reliability concern. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop within the package inducing stress and plastic deformation in...

2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Ghent, Belgium. pp.1-5, ⟨10.1109/EuroSimE.2014.6813772⟩. ⟨hal-03474091⟩

  • COMM

Agile and user centric SOA based service design framework applied in disaster management

Karima Ait Abdelouhab, Djilali Idoughi, Christophe Kolski

This article is a first step towards bridging the gap between User-centered design and agile principles integration in order to provide service designers/developers with a comprehensive framework to the design, implementation and deployment of SOA based interactive services. This approach is...

ICT-DM'2014, 1st IEEE International Conference on Information and Communication Technologies for Disaster Management, Institute of Electrical and Electronics Engineers (IEEE), Mar 2014, Alger, Algeria. ⟨10.1109/ICT-DM.2014.6917792⟩. ⟨hal-03383975⟩