Publications

Affichage de 3881 à 3890 sur 5406


  • Communication dans un congrès

Fracture mechanics in new designed power module under thermo‐mechanical loads

Camille Durand, Markus Klingler, Daniel Coutellier, Hakim Naceur, Arian Grams, Olaf Wittler

Thermo-mechanically induced failure is a major reliability issue in the microelectronic industry. On this account, a new type of Assembly Interconnected Technology used to connect MOSFETs in power modules has been developed. The reliability is increased by using a copper clip soldered on the top…

JIP 2014 - Fatigue Design & Material Defects, Jun 2014, Paris, France. pp.04015, ⟨10.1051/matecconf/20141204015⟩. ⟨hal-01669938⟩

  • Communication dans un congrès

Towards Qualitative and Quantitative Data Integration Approach for Enhancing HCI Quality Evaluation.

Ahlem Assila, Káthia Marçal de Oliveira, Houcine Ezzedine

Over the two past decades, various HCI quality evaluation methods have been proposed. Each one has its own strengths and its own shortcomings. Different methods are combined to enhance the evaluation results. To obtain better coverage of design problems and to increase the system performance,…

Human-Computer Interaction. Theories, Methods, and Tools - 16th International Conference, HCI International 2014, Jun 2014, Crete, Greece. pp.469-480, ⟨10.1007/978-3-319-07233-3_43⟩. ⟨hal-03388009⟩

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