Publications

Affichage de 4411 à 4420 sur 5560


  • Communication dans un congrès

Recherche à voisinage variable pour un problème de tournées avec gestion de stock multiproduit

Anis Mjirda, Bassem Jarboui, Rita Macedo, Said Hanafi

14ème congrès de la Société Française de Recherche Opérationnelle et d’Aide à la Décision ROADEF 2013, 2013, Troyes, France. ⟨hal-03582923⟩

  • Communication dans un congrès

Component based framework to create mobile cross-platform applications

Joachim Perchat, Mikael Desertot, Sylvain Lecomte

Smartphones provide a set of native functionalities and another set of functionalities available through third-party applications. The emergence of more and more actors, without standards to provide their devices or OS, stops the cross-platform development. Indeed, a developer would have to learn…

The 4th International Conference on Ambient Systems, Networks and Technologies, Jun 2013, Halifax, Canada. pp.1004-1011, ⟨10.1016/j.procs.2013.06.140⟩. ⟨hal-03472627⟩

  • Communication dans un congrès

Heart Rate/Cycling Power Control System

Sami Mohammad, Thierry-Marie Guerra, Jean-Marie Grosbois, Benjamin Hecquet

The system of heart rate/cycling power can be modeled through a nonlinear Hammerstein ARX model with uncertainties. Therefore, we investigate these models via the so-called Takagi-Sugeno (TS) framework. TS models belong to the family of quasi-LPV and allow an exact representation of the nonlinear…

5th IFAC Symposium on System Structure and Control, Feb 2013, Grenoble, France. pp.821-826, ⟨10.3182/20130204-3-FR-2033.00196⟩. ⟨hal-03467465⟩

  • Communication dans un congrès

Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module

Camille Jeanne Margot Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a…

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wrockaw, Poland. ⟨10.1109/EuroSimE.2013.6529900⟩. ⟨hal-03513207⟩