Publications

Affichage de 3851 à 3860 sur 5524


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ARABICA: A Reconfigurable Arithmetic Block for ISA Customization

Ihsen Alouani, Mazen Saghir, Smail Niar

The 10th International Symposium on Applied Reconfigurable Computing, ARC'2014, Apr 2014, Vilamoura, Portugal. ⟨hal-03474281⟩

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Human factors in railway by EURNEX: the HORTENS pole

Frédéric Vanderhaegen, Jean-Marie Burkhart

TRA2014 Transport Research Arena 2014, Apr 2014, Paris, France. ⟨hal-03470092⟩

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Multimodal biometric systems

Cherif Taouche, Mohamed Batouche, Mohamed Berkane, Abdelmalik Taleb-Ahmed

Biometric is a unique, measurable physiological or behavioral characteristic of a person. The biometric system is one such that can provide accurate and reliable scheme for person verification and authentication. Unimodal biometric systems have to contend with a variety of problems such as noisy…

2014 International Conference on Multimedia Computing and Systems (ICMCS), Apr 2014, Marrakech, Morocco. pp.301-308, ⟨10.1109/ICMCS.2014.6911308⟩. ⟨hal-03663750⟩

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Conception of driver's risky state detection system

Nedjemi Rachedi, Denis Berdjag, Frédéric Vanderhaegen

TRA2014 Transport Research Arena 2014, Apr 2014, Paris, France. ⟨hal-03470156⟩

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A numerical tool to design safe rail infrastructure dedicated to education

Frédéric Vanderhaegen, Philippe Richard

TRA2014 Transport Research Arena 2014, Apr 2014, Paris, France. ⟨hal-03470028⟩

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Affordance perception in microgravity, the « Passages » project. ESA Workshop Human Research on the International Space Station, Recent results and Lesson Learned.

Aurore Bourrelly, Joseph Mcintyre, Marion Luyat

European Spatial Agency, ESTEC, ESA, Apr 2014, Noordwijkerhout, Netherlands. ⟨hal-04099769⟩

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Failure mechanisms in chip-metallization in power applications

Camille Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

Degradation of the chip-metallization layer in power electronic packages under Active Power Cycling is still a major reliability concern. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop within the package inducing stress and plastic deformation in…

2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Ghent, Belgium. pp.1-5, ⟨10.1109/EuroSimE.2014.6813772⟩. ⟨hal-03474091⟩